參數(shù)資料
型號(hào): MT9088IG
廠商: Zarlink Semiconductor Inc.
英文描述: TDM to Packet Processors
中文描述: TDM到分組處理器
文件頁(yè)數(shù): 66/97頁(yè)
文件大?。?/td> 702K
代理商: MT9088IG
MT90880/1/2/3
Data Sheet
66
Zarlink Semiconductor Inc.
Connecting to multiple external memory devices
The four devices are connected in banks, and the MT90880 device automatically switches to the next bank
when the address exceeds the range of the bank. Therefore the MT90880 needs to be informed during
initialisation which memory size is being used. This affects the number of active address signals and the total
available memory size, as shown in Table 17. Inactive address signals always output a low state.
Connection to the memory devices is identical to that for a single memory device (see Figure 29), except that
the four memory bank write enable signals, and the four memory bank output enable signals are connected to
each memory device in turn, e.g. RAM_WE[0]# to device 1, RAM_WE[1]# to device 2, etc. All other connections
and tie-offs are the same.
Table 29 - Total Available Memory Size, Using Four External SSRAM Devices
SSRAM size
Total available capacity using 4 devices
Active address
signals
16 Mbs
8 Mbytes
20:2
8 Mbs
4 Mbytes
19:2
4 Mbs
2 Mbytes
18:2
2 Mbs
1 Mbytes
17:2
1 Mbs
0.5 Mbytes
16:2
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MAQ2901CL Circular Connector; No. of Contacts:85; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:40; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No
MAQ2901CS Circular Connector; No. of Contacts:1; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:10S; Circular Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:10S-2 RoHS Compliant: No
MAQ2901FB ER 3C 3#16 PIN RECP WALL RoHS Compliant: No
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