- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄4042 > MPC7410VS500LE (Freescale Semiconductor)IC MPU PPC 500MHZ 360-FCCLGA PDF資料下載
參數(shù)資料
| 型號： | MPC7410VS500LE |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 41/56頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU PPC 500MHZ 360-FCCLGA |
| 標準包裝： | 44 |
| 系列： | MPC74xx |
| 處理器類型： | 32-位 MPC74xx PowerPC |
| 速度： | 500MHz |
| 電壓： | 1.8V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 360-CLGA，F(xiàn)CCLGA |
| 供應(yīng)商設(shè)備封裝： | 360-FCCLGA（25x25） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁當前第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁
MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
46
Freescale Semiconductor
System Design Information
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
8.8.3 Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
Tj = Ta + Tr + (θjc + θint + θsa) × Pd
where:
Tj is the die-junction temperature
Ta is the inlet cabinet ambient temperature
Tr is the air temperature rise within the computer cabinet
θjc is the junction-to-case thermal resistance
θint is the adhesive or interface material thermal resistance
θ
sa is the heat sink base-to-ambient thermal resistance
Pd is the power dissipated by the device
During operation the die-junction temperatures (Tj) should be maintained less than the value specified in Table 3.
The temperature of the air cooling the component greatly depends upon the ambient inlet air temperature and the air
temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (Ta) may range from 30°
to 40°C. The air temperature rise within a cabinet (Tr) may be in the range of 5° to 10°C. The thermal resistance of
the thermal interface material (
θint) is typically about 1°C/W. Assuming a Ta of 30°C, a Tr of 5°C, a CBGA package
θ
jc = 0.03, and a power consumption (Pd) of 5.0 W, the following expression for Tj is obtained:
Die-junction temperature:
Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + θsa) × 5.0 W
For a Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (
θ
sa) versus airflow velocity is
shown in Figure 30.
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7°C/W, thus
Tj = 30°C + 5°C + (0.03°C/W + 1.0°C/W + 7°C/W) × 5.0 W,
resulting in a die-junction temperature of approximately 75°C which is well within the maximum operating
temperature of the component.
Other heat sinks offered by Aavid Thermalloy, Alpha Novatech, The Bergquist Company, IERC, and Wakefield
Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8567VTAUJJ | MPU POWERQUICC III 1023-PBGA |
| IDT70V9179L9PF8 | IC SRAM 288KBIT 9NS 100TQFP |
| MPC8543ECPXAQGB | MPU POWERQUICC III 783-PBGA |
| MPC8266AZUPJDC | IC MPU POWERQUICC II 480-TBGA |
| ACB108DHAD | CONN EDGECARD 216PS R/A .050 DIP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC7441 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7445 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7447 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7447A | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
| MPC7447A_06 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:RISC Microprocessor Hardware Specifications |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。