MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS
參數(shù)資料
型號(hào): MCZ33797EKR2
廠商: Freescale Semiconductor
文件頁數(shù): 33/36頁
文件大?。?/td> 0K
描述: IC SQUIB DRIVER 2CHAN 32-SOIC
標(biāo)準(zhǔn)包裝: 1,000
系列: *
應(yīng)用: *
接口: *
電源電壓: *
封裝/外殼: 32-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 32-SOIC
包裝: 帶卷 (TR)
安裝類型: 表面貼裝
Analog Integrated Circuit Device Data
6
Freescale Semiconductor
33797
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground, unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent
damage to the device.
Rating
Symbol
Value
Unit
INPUT ELECTRICAL RATINGS
Voltage on VDD
VDD
7.0
V
Voltage on Input pins CS, CLK, D1, D0, FEN_1, FEN_2, RESET,
R_DIAG, R_LIMIT_X
VI
-0.3 to VDD + 0.3
V
Voltage on Squib pins SQB_HI_XX, SQB_LO_XX, SENSE_XX
VVFIRE_XX
-0.3 to VVFIRE + 0.3
V
Voltage on pins VDIAG_X, VFIRE_XX
VDIAG_X
-0.3 to 35
V
ESD Voltage (1)
Human Body Model
Machine Model
VESD1
VESD2
±2000
±200
V
Maximum VVFIRE with Pulsed Output (1), (2)
RSQUIB = 2.0 , tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 1.2 , tON = 0.8 ms, ISQUIB = 2.24 A
RSQUIB = 0.1 , tON = 0.60 ms, ISQUIB = 2.24 A
VFPULSE
35
25
V
THERMAL RATINGS
Storage Temperature
TSTG
155
C
Junction Temperature Ambient
Continuous (Prior to Squib Deployment)
t
5.0 ms (Post-squib Deployment)
TA
TJCONT
TJDPYD
85
100
300
C
Peak Package Reflow Temperature During Reflow (3), (4)
TPPRT
°C
Thermal Resistance (Junction-to-Ambient)
RJA
74
C/W
Notes
1
ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ).
2
With a nominal squib load, the FET squib driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms.
The individual squib driver thermal shutdown will not affect other squib driver firing “ON” times. With a shorted squib load, the FET squib
driver will not enter thermal shutdown until the driver has been active for a minimum of 2.1 ms. When the thermal shutdown limit is
exceeded, the FET driver will turn OFF and the thermal status bit will be set to 1. The FET squib driver can be activated through the
arm/fire command when the TEMPRENABLE (MIN) is reached (thermal shutdown status “0”). Nominal squib load is 2.15 ±0.15 .
Shorted squib load is 0.1
3
Three squib driver with RSQUIB = 0.1 conditions. Remaining squib driver conditions: RSQUIB = 1.2 , tON = 4.0 ms, ISQUIB = 2.0 A,
VVDIAG_X = VVFIRE_XX = 35 V.
4
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
5.
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