![](http://datasheet.mmic.net.cn/80000/LTC4110EUHF-TR_datasheet_2357935/LTC4110EUHF-TR_6.png)
LTC4110
6
4110fb
Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime. Specic functionality or parametric performance
of the device beyond the limits expressly given in the Electrical
Characteristics table is not implied by these maximum ratings.
Note 2: The LTC4110E is guaranteed to meet performance specications
from 0°C to 85°C. Specications over the –40°C to 85°C operating
temperature range are assured by design, characterization and correlation
with statistical process controls.
Note 3: This IC includes overtemperature protection that is intended
to protect the device during momentary overload conditions.
Overtemperature protection will become active at a junction temperature
greater than the maximum operating junction temperature. Continuous
operation above the specied maximum operation temperature may result
in device degradation or failure. Operating junction temperature TJ (in
°C) is calculated from the ambient temperature TA and the average power
dissipation PD (in watts) by the formula TJ = TA + θJA PD.
ELECTRICAL CHARACTERISTICS The l denotes the specications which apply over the full operating
temperature range, otherwise specications are at TA = 25°C. Unless otherwise specied, VDCIN = VDCOUT = VDCDIV = 12V, VBAT = 8.4V,
GND = SGND = CLP = CLN = SHDN = 0V and RVREF = 49.9k. All currents into device pins are positive and all currents out of device pins
are negative. All voltages are referenced to GND, unless otherwise specied.
Note 4: The LTC4110 is idle with no application load. It is not charging
or calibrating the battery and is not in backup or shutdown mode. The
internal clock is running and the SMBus is functional.
Note 5: Combined current of CSP, CSN and BAT pins set to VBAT with no
application load.
Note 6: CTH is dened as the sum of capacitance on THA, THB
SafetySignal.
Note 7: Does not include tolerance of current sense or current
programming resistors.
Note 8: Given as a per cell voltage referred to the BAT pin (VBAT/number of
series cells).
Note 9: Refer to System Management Bus Specication, Revision 1.1,
section 2.1 for Timing Diagrams and section 8.1, for tLOW and tTIMEOUT
requirements.
Note 10: Specications over the –5°C to 85°C operating ambient
temperature range are assured by design, characterization and correlation
with statistical process controls.
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
VREMH
THB Pin Battery Removal Threshold
Hysteresis Voltage
VTHB Decreasing; Lead Acid Only
25
mV
Logic and Status Output Levels
VILS
SCL/SDA Input Pins Low Voltage
l
0.8
V
VIHS
SCL/SDA Input Pins High Voltage
l
2.1
V
VOLS
SDA Output Pin Low Voltage
IPULL-UP = 350μA
l
0.4
V
VOLG
ACPb, GPIO1,2,3 Output Pins Low Voltage
IACPb, IGPIO1, IGPIO2, IGPIO3 = 10mA
1
V
IOHG
ACPb, GPIO1,2,3 Output Pins Open
Leakage Current
Outputs Open, VACPb, VGPIO1,2,3 = 5V
–2
2
μA
VILG
GPIO Input Low Voltage
l
1V
VIHG
GPIO Input High Voltage
l
1.5
V
VILSD
SHDN Input Pin Low Voltage
0.5
V
VIHSD
SHDN Input Pin High Voltage
2.4
V
IISD
SHDN Input Pin Pull-Up Current
VSHDN = 2.4V
–3.5
–2
–1
μA
TLR
Logic Reset Duration After Power-Up
From Zero
VDCIN Transition From 0V to 5V in <1ms;
VBAT = 0
1s
SMBus Timing (Note 9)
tHIGH
SCL Serial Clock High Period
IPULL-UP = 350μA, CLOAD = 250pF,
RPU = 9.31k
l
4μs
tLOW
SCL Serial Clock Low Period
IPULL-UP = 350μA, CLOAD = 250pF,
RPU = 9.31k
l
4.7
μs
tTO
Timeout Period
l
25
ms
tF
SDA/SCL Fall Time
CLOAD = 250pF, RPU = 9.31k
l
300
ns
tSU-STA
Start Condition Set-Up Time
l
4.7
μs
tHD-STA
Start Condition Hold Time
l
4μs
tHD-DAT
SDA to SCL Falling-Edge Hold Time,
Slave Clocking in Data
l
300
ns