參數(shù)資料
型號(hào): LFXP15C-4FN256C
廠商: LATTICE SEMICONDUCTOR CORP
元件分類: FPGA
中文描述: FPGA, 1932 CLBS, PBGA256
封裝: 17 X 17 MM, LEAD FREE, FPBGA-256
文件頁(yè)數(shù): 65/130頁(yè)
文件大?。?/td> 1312K
代理商: LFXP15C-4FN256C
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)當(dāng)前第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)
July 2007
Data Sheet DS1001
2007 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
2-1
DS1001 Architecture_02.0
Architecture Overview
The LatticeXP architecture contains an array of logic blocks surrounded by Programmable I/O Cells (PIC). Inter-
spersed between the rows of logic blocks are rows of sysMEM Embedded Block RAM (EBR) as shown in Figure 2-
On the left and right sides of the PFU array, there are Non-volatile Memory Blocks. In configuration mode this non-
volatile memory is programmed via the IEEE 1149.1 TAP port or the sysCONFIG peripheral port. On power up,
the configuration data is transferred from the Non-volatile Memory Blocks to the configuration SRAM. With this
technology, expensive external configuration memories are not required and designs are secured from unauthor-
ized read-back. This transfer of data from non-volatile memory to configuration SRAM via wide busses happens in
microseconds, providing an “instant-on” capability that allows easy interfacing in many applications.
There are two kinds of logic blocks, the Programmable Functional Unit (PFU) and Programmable Functional unit
without RAM/ROM (PFF). The PFU contains the building blocks for logic, arithmetic, RAM, ROM and register func-
tions. The PFF block contains building blocks for logic, arithmetic and ROM functions. Both PFU and PFF blocks
are optimized for flexibility, allowing complex designs to be implemented quickly and efficiently. Logic Blocks are
arranged in a two-dimensional array. Only one type of block is used per row. The PFU blocks are used on the out-
side rows. The rest of the core consists of rows of PFF blocks interspersed with rows of PFU blocks. For every
three rows of PFF blocks there is a row of PFU blocks.
Each PIC block encompasses two PIOs (PIO pairs) with their respective sysIO interfaces. PIO pairs on the left and
right edges of the device can be configured as LVDS transmit/receive pairs. sysMEM EBRs are large dedicated fast
memory blocks. They can be configured as RAM or ROM.
The PFU, PFF, PIC and EBR Blocks are arranged in a two-dimensional grid with rows and columns as shown in
Figure 2-1. The blocks are connected with many vertical and horizontal routing channel resources. The place and
route software tool automatically allocates these routing resources.
At the end of the rows containing the sysMEM Blocks are the sysCLOCK Phase Locked Loop (PLL) Blocks. These
PLLs have multiply, divide and phase shifting capability; they are used to manage the phase relationship of the
clocks. The LatticeXP architecture provides up to four PLLs per device.
Every device in the family has a JTAG Port with internal Logic Analyzer (ispTRACY) capability. The sysCONFIG
port which allows for serial or parallel device configuration. The LatticeXP devices are available for operation from
3.3V, 2.5V, 1.8V and 1.2V power supplies, providing easy integration into the overall system.
LatticeXP Family Data Sheet
Architecture
相關(guān)PDF資料
PDF描述
LFZ3508VXX GENERAL PURPOSE INDUCTOR
LFZ2805HXX GENERAL PURPOSE INDUCTOR
LF02004VTX GENERAL PURPOSE INDUCTOR
LG3341-NE7501 T-1 SINGLE COLOR LED, GREEN, 3 mm
LG3341-KNE9117 T-1 SINGLE COLOR LED, GREEN, 3 mm
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
LFXP15C-4FN256I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15.4K LUTs 188 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFXP15C-4FN388C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15.4K LUTs 268 IO 1. 8/2.5/3.3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFXP15C-4FN388I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15.4K LUTs 268 IO 1. 8/2.5/3.3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFXP15C-4FN484C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15.4K LUTs 1.8/2.5/3 .3V -4 Spd RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
LFXP15C-4FN484I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門陣列 15.4K LUTs 1.8/2.5/3 .3V-4 Spd I RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256