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CDMA /AMPS Dual Band
Upconverter/VGA/Driver Amplifier
Technical Data
HPMX-7201
General Description
The HPMX-7201 upconverter is
designed for use in Dual Band/
Dual mode PCS-CDMA/AMPS
handsets and complements
Agilent Technologies’s CDMA
Chipset solution.
The HPMX-7201 contains an
upconverter and RF variable gain
driver amplifier for the PCS-CDMA
5x 5 mm TQFP-32 Package
Pin Configuration
Features
Dual Band/Dual Mode
Operation
High Output Power to
Directly Drive the Power
Amplifiers
30 dB Gain Control and
Adaptive Biasing on CDMA
Driver
2.7 to 3.6V Operation
Switched CDMA Driver
Outputs to Support
Split-band Filters
ACPR Compliant
Low Output Noise Power
Power Down Capability
70 mA Average Supply
Current ( CDG suburban
user model)
J EDEC Standard 5x5 mm
TQFP-32 Surface Mount
Package
Applications
CDMA1900/AMPS Handsets
HPMX-7201
Y WW
32
1
25
24
fm
gnd
cdmaDrvOut1
gnd
gnd
cdmaDrvOut2
gnd
cdmaOutSel
ampsMixOutM
ampsMixOutP
gnd
cdmaDrvIn
gnd
gnd
cdmaMixOutM
cdmaMixOutP
i
i
g
V
L
L
R
V
a
g
a
V
g
V
p
V
8
17
9
16
XXXXX ZZ
transmit chain. The AMPS transmit
chain features an image reject
upconverter and a driver amplifier.
The PCS-CDMA transmit chain
provides excellent Adjacent
Channel Power Rejection and a
low noise floor for compliance
with TIA98-C requirements. The
CDMA driver has a high output
power for direct interfacing with
CDMA Power Amplifiers and
incorporates a switch on the
output to support split-band
filtering. The driver is adaptively
biased to reduce current con-
sumption and extend battery life.
The image reject upconverter on
the AMPS transmit chain elimi-
nates the need for a filter
between the mixer and the driver
amplifier.
The IC operates from a 3V
regulated supply, making it ideal
for use with a single cell Lithium
Ion battery. The Drivers can be
directly powered from the battery
for enhanced performance. The
power down function reduces the
supply current to 1
μ
A, typical to
support gated operation and
eliminate the need for a power
supply switch.
The HPMX-7201 is fabricated
using a 40 GHz Fmax silicon
bipolar process and is packaged in
a 5x5mm 32 pin TQFP package.