參數(shù)資料
型號: ADUC7032BSTZ-88
廠商: Analog Devices Inc
文件頁數(shù): 99/120頁
文件大小: 0K
描述: IC MCU 96K FLASH DUAL 48LQFP
標(biāo)準(zhǔn)包裝: 1
系列: MicroConverter® ADuC7xxx
核心處理器: ARM7
芯體尺寸: 16/32-位
速度: 20.48MHz
連通性: LIN,SPI,UART/USART
外圍設(shè)備: POR,PSM,溫度傳感器,WDT
輸入/輸出數(shù): 9
程序存儲器容量: 96KB(48K x 16)
程序存儲器類型: 閃存
RAM 容量: 1.5K x 32
電壓 - 電源 (Vcc/Vdd): 3.5 V ~ 18 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 2x16b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 48-LQFP
包裝: 托盤
ADuC7032-8L
Rev. A | Page 8 of 120
Parameter
Test Conditions/Comments
Min
Typ
Max
Unit
PACKAGE THERMAL
SPECIFICATIONS
Thermal Shutdown31
140
150
160
°C
Thermal Impedance (
θJA)32
48-lead LQFP, stacked die
Top die
50
°C/W
Bottom die
25
°C/W
POWER REQUIREMENTS
Power Supply Voltages
VDD (Battery Supply)
3.5
18
V
REG_DVDD, REG_AVDD33
2.5
2.6
2.7
V
Power Consumption
IDD (MCU Normal Mode)34
MCU clock rate = 10.24 MHz, ADC off
10
20
mA
MCU clock rate = 20.48 MHz, ADC off
20
30
mA
IDD (MCU Powered Down)1
ADC low power mode, measured over an ambient temperature range
of 10°C to +40°C (continuous ADC conversion)
300
400
μA
ADC low power mode, measured over an ambient temperature range
of 40°C to +85°C (continuous ADC conversion)
300
500
μA
ADC low power plus mode, measured over an ambient temperature
range of 10°C to +40°C (continuous ADC conversion)
520
700
μA
Average current, measured with wake-up and watchdog timer
clocked from low power oscillator (40°C to +85°C)
120
300
μA
Average current, measured with wake-up and watchdog timer clocked
from low power oscillator over an ambient temperature range of 10°C
to +40°C
120
175
μA
IDD (Current ADC)
1.7
mA
IDD (Voltage/Temperature
ADC)
Per ADC
0.5
mA
IDD (Precision Oscillator)
400
μA
1 Not guaranteed by production test, but by design and/or characterization data at production release.
2 Valid for current ADC gain setting of PGA = 4 to 64.
3 These numbers include temperature drift.
4 Tested at gain range = 4; self-offset calibration removes this error.
5 Measured with an internal short after an initial offset calibration.
6 Measured with an internal short.
7 Includes internal reference temperature drift.
8 Factory calibrated at gain = 1.
9 System calibration at specific gain range removes the error at this gain range at that temperature.
10 Valid when used in conjunction with the ADCREF (the low power mode reference error) MMR.
11 Typical noise in low power modes is measured with chop enabled.
12 Voltage channel specifications include resistive attenuator input stage.
13 Includes an initial system calibration.
14 System calibration removes this error at that temperature.
15 RMS noise is referred to voltage attenuator input. For example, at fADC = 1 kHz, typical rms noise at the ADC input is 7.5 μV, which, when scaled by the attenuator (24),
yields these input referred noise figures.
16 ADC self-offset calibration removes this error.
17 Valid after an initial self-calibration.
18 Factory calibrated for the internal temperature sensor during final production test.
19 In ADC low power mode, the input range is fixed at ±9.375 mV. In ADC low power plus mode, the input range is fixed at ±2.34375 mV.
20 It is possible to extend the ADC input range by up to 10% by modifying the factory set value of the gain calibration register or using system calibration. This approach
can also be used to reduce the ADC input range (LSB size).
21 Limited by minimum/maximum absolute input voltage range.
22 Valid for a differential input less than 10 mV.
23 Measured using box method.
24 The long-term stability specification is noncumulative. The drift in subsequent 1000 hour periods is significantly lower than in the first 1000 hour period.
25 References of up to REG_AVDD can be accommodated by enabling an internal divide-by-2.
26 Die temperature.
27 Endurance is qualified to 10,000 cycles, as per JEDEC Std. 22 Method A117, and measured at 40°C, +25°C, and +125°C. Typical endurance at 25°C is 170,000 cycles.
28 Retention lifetime equivalent at junction temperature (TJ) = 85°C, as per JEDEC Std. 22 Method A117. Retention lifetime derates with junction temperature.
29 Low power oscillator can be calibrated against either the precision oscillator or the external 32.768 kHz crystal in user code.
30 These numbers are not production tested but are supported by LIN compliance testing.
31 The MCU core is not shut down, but an interrupt is generated, if enabled.
32 Thermal impedance can be used to calculate the thermal gradient from ambient to die temperature.
33 Internal regulated supply available at REG_DVDD (ISOURCE = 5 mA) and REG_AVDD (ISOURCE = 1 mA).
34 Typical additional supply current consumed during Flash/EE memory program and erase cycles is 7 mA and 5 mA, respectively.
相關(guān)PDF資料
PDF描述
ADUC7032BSTZ-8V-RL IC BATTERY SENSOR PREC 48-LQFP
ADUC7034BCPZ IC MCU FLASH 32K ANLG IO 48LFCSP
ADUC7036CCPZ IC MCU 96K FLASH DUAL 48LFCSP
ADUC7039BCP6Z-RL IC MCU ARM7 BATT SENSER 32LFCSP
ADUC7061BCPZ32 IC MCU 16/32BIT 32KB 32LFCSP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADUC7032BSTZ-88-RL 功能描述:IC MCU 96K FLASH DUAL 48LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MicroConverter® ADuC7xxx 標(biāo)準(zhǔn)包裝:38 系列:Encore!® XP® 核心處理器:eZ8 芯體尺寸:8-位 速度:5MHz 連通性:IrDA,UART/USART 外圍設(shè)備:欠壓檢測/復(fù)位,LED,POR,PWM,WDT 輸入/輸出數(shù):16 程序存儲器容量:4KB(4K x 8) 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:1K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 3.6 V 數(shù)據(jù)轉(zhuǎn)換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 105°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:管件 其它名稱:269-4116Z8F0413SH005EG-ND
ADUC7032BSTZ-8L 制造商:Analog Devices 功能描述:FLASH 96K ARM7 TRIPLE 16-BIT ADC LIN IC. - Trays
ADUC7032BSTZ-8L-RL 制造商:Analog Devices 功能描述:FLASH 96K ARM7 TRIPLE 16-BIT ADC LIN IC. - Tape and Reel
ADUC7032BSTZ-8V 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述:
ADUC7032BSTZ-8V-RL 功能描述:IC BATTERY SENSOR PREC 48-LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器, 系列:MicroConverter® ADuC7xxx 標(biāo)準(zhǔn)包裝:1,500 系列:AVR® ATtiny 核心處理器:AVR 芯體尺寸:8-位 速度:16MHz 連通性:I²C,LIN,SPI,UART/USART,USI 外圍設(shè)備:欠壓檢測/復(fù)位,POR,PWM,溫度傳感器,WDT 輸入/輸出數(shù):16 程序存儲器容量:8KB(4K x 16) 程序存儲器類型:閃存 EEPROM 大小:512 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:20-SOIC(0.295",7.50mm 寬) 包裝:帶卷 (TR)