參數資料
型號: XC3S200AN-4FT256I
廠商: Xilinx Inc
文件頁數: 110/123頁
文件大?。?/td> 0K
描述: IC FPGA SPARTAN 3AN 256FTBGA
標準包裝: 90
系列: Spartan®-3AN
LAB/CLB數: 448
邏輯元件/單元數: 4032
RAM 位總計: 294912
輸入/輸出數: 195
門數: 200000
電源電壓: 1.14 V ~ 1.26 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 256-LBGA
供應商設備封裝: 256-FTBGA
Spartan-3AN FPGA Family: Pinout Descriptions
DS557 (v4.1) April 1, 2011
Product Specification
87
Footprint Migration Differences
Unconnected Balls on XC3S50AN
Table 73 summarizes any footprint and functionality differences between the XC3S50AN and the XC3S200AN or
XC3S400AN devices for migration between these devices in the FTG256 package. The XC3S200AN and XC3S400AN have
identical pinouts. The XC3S50AN pinout is compatible with the XC3S200AN and XC3S400AN, however, there are 51
unconnected balls and one functionally different ball. Generally, designs migrate upward from the XC3S50AN to either the
XC3S200AN or XC3S400AN. If using differential I/O, see Table 74. If using the BPI configuration mode (parallel Flash), see
In Table 73, the arrow (
) indicates that this pin can unconditionally migrate from the device on the left to the device on the
right. Migration in the other direction is possible depending on how the pin is configured for the device on the right.
Table 73: FTG256 XC3S50AN Footprint Migration/Differences
FTG256 Ball
Bank
XC3S50AN
Migration
XC3S200AN or XC3S400AN
A7
0
N.C.
I/O
A12
0
N.C.
I/O
B12
0
INPUT
I/O
C7
0
N.C.
I/O
D10
0
N.C.
I/O
E2
3
N.C.
I/O
E3
3
N.C.
I/O
E7
0
N.C.
I/O/VREF
E10
0
N.C.
I/O/VREF
E16
1
N.C.
I/O
F3
3
N.C.
I/O
F8
0
N.C.
I/O
F14
1
N.C.
I/O
F15
1
N.C.
I/O
F16
1
N.C.
I/O
G3
3
N.C.
I/O
G4
3
N.C.
I/O
G5
3
N.C.
INPUT/VREF
G6
3
N.C.
INPUT
G13
1
N.C.
I/O
G14
1
N.C.
I/O
G16
1
N.C.
I/O
H4
3
N.C.
I/O
H5
3
N.C.
I/O
H6
3
N.C.
I/O
H13
1
N.C.
I/O
J4
3
N.C.
I/O
J6
3
N.C.
I/O
J10
1
N.C.
INPUT/VREF
J11
1
N.C.
INPUT
K4
3
N.C.
I/O
相關PDF資料
PDF描述
XC3S400AN-4FTG256C IC FPGA SPARTAN-3AN 256FTBGA
RSA50DTAD-S664 CONN EDGECARD 100PS R/A .125 SLD
24LC32AFT-E/OT IC SRL EEPROM 4KX8 2.5V SOT23-5
RMA50DTAD-S664 CONN EDGECARD 100PS R/A .125 SLD
24AA32AFT-I/MS IC SRL EEPROM 4KX8 1.8V 8-MSOP
相關代理商/技術參數
參數描述
XC3S200AN-4FTG256C 功能描述:IC SPARTAN-3AN FPGA 200K 256FTBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3AN 標準包裝:60 系列:XP LAB/CLB數:- 邏輯元件/單元數:10000 RAM 位總計:221184 輸入/輸出數:244 門數:- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
XC3S200AN4FTG256CES 制造商:Xilinx 功能描述:
XC3S200AN-4FTG256CES 制造商:Xilinx 功能描述:
XC3S200AN-4FTG256I 功能描述:IC SPARTAN-3AN FPGA 200K 256FTBG RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:Spartan®-3AN 標準包裝:60 系列:XP LAB/CLB數:- 邏輯元件/單元數:10000 RAM 位總計:221184 輸入/輸出數:244 門數:- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
XC3S200AN-5FT256C 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN 200K GATES 4032 CELLS 770MHZ 1.2V 256FTBGA - Trays 制造商:Xilinx 功能描述:IC FPGA SPARTAN-3AN 200K 256BGA 制造商:Xilinx 功能描述:IC FPGA 195 I/O 256FTBGA