參數(shù)資料
型號(hào): UPD720114GA-9EU-A
廠商: NEC Corp.
英文描述: MOS INTEGRATED CIRCUIT
中文描述: 馬鞍山集成電路
文件頁數(shù): 28/32頁
文件大?。?/td> 300K
代理商: UPD720114GA-9EU-A
Data Sheet S17462EJ2V0DS
28
μ
PD720114
4.
RECOMMENDED SOLDERING CONDITIONS
The
μ
PD720114 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
μ
PD720114GA-9EU-A:
48-pin plastic TQFP (Fine pitch) (7
×
7)
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
Flux: Rosin flux with low chlorine (0.2 Wt% or below) recommended.
IR60-103-3
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
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