參數(shù)資料
型號: UPD17240MC-XXX-5A4-A
元件分類: 微控制器/微處理器
英文描述: 4-BIT, MROM, 8 MHz, MICROCONTROLLER, PDSO30
封裝: 0.300 INCH, PLASTIC, SSOP-30
文件頁數(shù): 99/102頁
文件大?。?/td> 668K
代理商: UPD17240MC-XXX-5A4-A
96
Data Sheet U15002EJ1V0DS
PD17240, 17241, 17242, 17243, 17244, 17245, 17246
17. RECOMMENDED SOLDERING CONDITIONS
The
PD17240, 17241, 17242, 17243, 17244, 17245, and 17246 should be soldered and mounted under the
following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Table 17-1. Surface Mounting Type Soldering Conditions
PD17240MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17241MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17242MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17243MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17244MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17245MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
PD17246MC-×××-5A4: 30-pin plastic SSOP (7.62 mm (300))
Recommended Condition
Soldering Method
Soldering Conditions
Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-00-3
(at 210
°C or higher), Count: Three times or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-00-3
(at 200
°C or higher), Count: Three times or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max., Count: Once, WS60-00-1
Preheating temperature: 120
°C max. (package surface temperature)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
Caution Do not use different soldering methods together (except for partial heating).
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