參數(shù)資料
型號(hào): UPC1862
廠商: NEC Corp.
英文描述: BURST LOCK CLOCK GENERATOR
中文描述: 爆破鎖時(shí)鐘發(fā)生器
文件頁數(shù): 30/32頁
文件大?。?/td> 252K
代理商: UPC1862
30
μ
PC1862
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
For more details, refer to our document
“SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E)
.
Surface Mount Device
μ
PC1862GS: 36-pin plastic shrink SOP (300 mil)
Process
Conditions
Symbol
Infrared ray reflow
Peak temperature: 235
°
C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210
°
C or higher),
Maximum number of reflow processes: 2 times.
IR35-00-2
VPS
Peak temperature: 215
°
C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200
°
C or higher),
Maximum number of reflow processes: 2 times.
VP15-00-2
Wave Soldering
Solder temperature: 260
°
C or below, Flow time: 10 seconds or less,
Maximum number of flow process: 1 time,
Pre-heating temperature: 120
°
C or below (Package surface temperature).
WS60-00-1
Partial heating method
Pin temperature: 300
°
C or below,
Heat time: 3 seconds or less (Per each side of the device).
Caution
Apply only one kind of soldering condition to a device, except for “Partial heating method”, or the
device will be damaged by heat stress.
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