TSC2003
2
SBAS162A
www.ti.com
MAXIMUM
INTEGRAL
MAXIMUM
SPECIFIED
LINEARITY ERROR
GAIN ERROR
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
(LSB)
PACKAGE-LEAD DESIGNATOR(1)
RANGE
MARKING
NUMBER
MEDIA, QUANTITY
TSC2003I
±2
±4
TSSOP-16
PW
–40
°C to +85°C
TSC2003I
Rails, 94
""
"
TSC2003IR
Tape and Reel, 2500
NOTE: (1) For the most current specifications and package information, refer to out web site at www.ti.com.
PIN CONFIGURATION
Top View
TSSOP
PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
1+VDD
Power Supply
2
X+
X+ Position Input
3
Y+
Y+ Position Input
4X–
X– Position Input
5Y–
Y– Position Input
6
GND
Ground
7VBAT1
Battery Monitor Input
8VBAT2
Battery Monitor Input
9VREF
Voltage Reference Input/Output
10
PENIRQ
Pen Interrupt. Open Drain Output (Requires 30k
to
100k
pull-up resistor externally).
11
SDA
Serial Data
12
SCL
Serial Clock
13
A1
I2C Bus Address Input A1
14
A0
I2C Bus Address Input A0
15
IN2
Auxiliary A/D Converter Input
16
IN1
Auxiliary A/D Converter Input
ABSOLUTE MAXIMUM RATINGS(1)
+VDD to GND ........................................................................ –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +VDD + 0.3V
Analog Input Voltage to GND. All Pins Except 7, 8 ...... –0.3V to +VDD + 0.3V
Analog Input Voltage Pins 7, 8 to GND ........................... –0.3V to +6.0V
Operating Temperature Range ........................................ –40
°C to +85°C
Storage Temperature Range ......................................... –65
°C to +150°C
Junction Temperature (TJ Max) .................................................... +150°C
TSSOP Package
Power Dissipation .................................................... (TJ Max – TA)/θJA
θ
JA Thermal Impedance ................................................... +115.2°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ............................................................ +215
°C
Infrared (15s) ..................................................................... +220
°C
NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
PACKAGE/ORDERING INFORMATION
1
2
3
4
5
6
7
8
+V
DD
X+
Y+
X–
Y–
GND
V
BAT1
V
BAT2
IN1
IN2
A0
A1
SCL
SDA
PENIRQ
V
REF
16
15
14
13
12
11
10
9
TSC2003