TSC2008
1
FEATURES
APPLICATIONS
DESCRIPTION
PENIRQ
SPI
Serial
Interface
and
Control
CS
SDI
X+
X-
Y+
Y-
AUX
TEMP
Mux
VDD/REF
GND
SAR
ADC
Internal
Clock
Touch
Screen
Sensor
Drivers
Preprocessing
SCLK
SDO
www.ti.com.......................................................................................................................................................... SBAS406B – JUNE 2008 – REVISED MARCH 2009
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire
Micro TOUCH SCREEN CONTROLLER with SPI
Cellular Phones
234
4-Wire Touch Screen Interface
PDA, GPS, and Media Players
Single 1.2V to 3.6V Supply/Reference
Portable Instruments
Ratiometric Conversion
Point-of-Sale Terminals
Effective Throughput Rate:
Multi-Screen Touch Control Systems
–
Up to 20kHz (8-Bit) or 10kHz (12-Bit)
Preprocessing to Reduce Bus Activity
High-Speed SPI (up to 25MHz)
The TSC2008 is a very low-power touch screen
Simple Command-Based User Interface:
controller designed to work with power-sensitive,
–
handheld applications that are based on advanced
low-voltage processors. It works with a supply voltage
–
8- or 12-Bit Resolution
as low as 1.2V, which can be supplied by a
On-Chip Temperature Measurement
single-cell battery. It contains a complete, ultra-low
Touch Pressure Measurement
power, 12-bit, analog-to-digital (A/D) resistive touch
screen converter, including drivers and the control
Digital Buffered PENIRQ
logic to measure touch pressure.
On-Chip, Programmable PENIRQ Pull-up
In addition to these standard features, the TSC2008
Auto Power-Down Control
offers
preprocessing
of
the
touch
screen
Low Power (12-Bit, 8.2kHz Eq Rate):
measurements to reduce bus loading, thus reducing
–
30.4
A at 1.2V, f
SCLK = 5MHz
the consumption of host processor resources that can
then be redirected to more critical functions.
–
35.5
A at 1.8V, f
SCLK = 10MHz
–
44.6
A at 2.7V, f
SCLK = 10MHz
The TSC2008 supports an SPI serial bus and data
transmission. It offers programmable resolution of 8
Power-On, Software, and SureSet Resets
or 12 bits to accommodate different screen sizes and
Enhanced ESD Protection:
performance needs.
–
±8kV HBM
The
TSC2008
is
available
in
a
12-lead,
–
±1kV CDM
(1,555 ±0,055mm) x (2,055 ±0,055mm) 3 x 4 array,
–
±25kV Air Gap Discharge
wafer chip-scale package (WCSP), and a 16-pin,
4 x 4 QFN package. The TSC2008 is characterized
–
±15kV Contact Discharge
for the –40°C to +85°C industrial temperature range.
1.5 x 2 WCSP-12 and 4 x 4 QFN-16 Packages
U.S. Patent No. 6246394; other patents pending.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
SureSet is a trademark of Texas Instruments.
3
SPI is a trademark of Motorola Inc.
4
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright 2008–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.