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CHAPTER 33 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U16228EJ2V0UD
528
Table 33-1. Surface Mounting Type Soldering Conditions (6/6)
(6) Flash memory version (GK-9ET type)
64-pin plastic TQFP (12
×
12)
μ
PD78F0134M1GK-9ET, 78F0134M2GK-9ET, 78F0134M3GK-9ET,
μ
PD78F0134M4GK-9ET, 78F0134M5GK-9ET, 78F0134M6GK-9ET,
μ
PD78F0134M1GK(A)-9ET, 78F0134M2GK(A)-9ET, 78F0134M3GK(A)-9ET,
μ
PD78F0134M4GK(A)-9ET, 78F0134M5GK(A)-9ET, 78F0134M6GK(A)-9ET,
μ
PD78F0134M1GK(A1)-9ET, 78F0134M2GK(A1)-9ET, 78F0134M5GK(A1)-9ET, 78F0134M6GK(A1)-9ET,
μ
PD78F0138M1GK-9ET, 78F0138M2GK-9ET, 78F0138M3GK-9ET,
μ
PD78F0138M4GK-9ET, 78F0138M5GK-9ET, 78F0138M6GK-9ET,
μ
PD78F0138M1GK(A)-9ET, 78F0138M2GK(A)-9ET, 78F0138M3GK(A)-9ET,
μ
PD78F0138M4GK(A)-9ET, 78F0138M5GK(A)-9ET, 78F0138M6GK(A)-9ET,
μ
PD78F0138M1GK(A1)-9ET, 78F0138M2GK(A1)-9ET, 78F0138M5GK(A1)-9ET, 78F0138M6GK(A1)-9ET
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max. (at 210
°
C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Note
(after that, prebake at 125
°
C for 10
IR35-103-2
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max. (at 200
°
C or higher),
Count: Twice or less, Exposure limit: 3 days
hours)
Note
(after that, prebake at 125
°
C for 10
VP15-103-2
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120
°
C max. (package surface temperature), Exposure
limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
WS60-103-1
Partial heating
Pin temperature: 300
°
C max., Time: 3 seconds max. (per pin row)
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).