參數(shù)資料
型號: PCA9698
廠商: NXP Semiconductors N.V.
英文描述: 40-bit Fm+ I2C-bus advanced I/O port with RESET, OE and INT
中文描述: 40位調(diào)頻I2C總線先進的I / O復位,光電和INT端口
文件頁數(shù): 44/47頁
文件大?。?/td> 214K
代理商: PCA9698
PCA9698_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 19 July 2006
44 of 47
Philips Semiconductors
PCA9698
40-bit Fm+ I
2
C-bus advanced I/O port with RESET, OE and INT
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note(AN01026);
order a copy from your Philips Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit
Packages; Section: Packing Methods
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
17. Abbreviations
Table 19.
Acronym
CDM
DUT
ESD
GPIO
HBM
I
2
C-bus
LED
MM
PICMG
PLC
POR
PWM
RAID
SMBus
Abbreviations
Description
Charged Device Model
Device Under Test
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Inter-Integrated Circuit bus
Light Emitting Diode
Machine Model
PCI Industrial Computer Manufacturers Group
Programmable Logic Controller
Power-On Reset
Pulse Width Modulation
Redundant Array of Independent Discs
System Management Bus
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