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| 型號(hào)： | MCIMX507CVM8B |
| 廠(chǎng)商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類(lèi)： | 微控制器/微處理器 |
| 英文描述： | SPECIALTY MICROPROCESSOR CIRCUIT, PBGA400 |
| 封裝： | 17 X 17 MM, 0.5 MM PITCH, ROHS COMPLIANT, PLASTIC, MABGA-400 |
| 文件頁(yè)數(shù)： | 32/120頁(yè) |
| 文件大小： | 1980K |
| 代理商： | MCIMX507CVM8B |
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Electrical Characteristics
i.MX50 Applications Processors for Consumer Products, Rev. 0
Freescale Semiconductor
19
4
Electrical Characteristics
This section provides the device and module-level electrical characteristics of the i.MX50 processor.
NOTE
These electrical specifications are preliminary. These specifications are not
fully tested or guaranteed at this early stage of the product life cycle.
Finalized specifications are published after thorough characterization and
device qualifications have been completed.
4.1
Chip-Level Conditions
This section provides the chip-level electrical characteristics for the IC. See Table 6 for a quick reference
to the individual tables and sections.
WDOG_RST_B_DEB
This output may be used to drive out the internal system reset signal to the system reset controller.
This is only intended for debug purposes.
XTAL/EXTAL
These pins are the 24 MHz crystal driver as well as the external 24 MHz clock input.
If using these pins to directly drive a 24 MHz crystal:
The user should tie a 24 MHz fundamental-mode crystal across XTAL and EXTAL.
The crystal must be rated for a maximum drive level of 100
μW or higher.
The recommended crystal ESR (equivalent series resistance) is 80
Ω or less.
If using these pins as a clock input from an external 24 MHz oscillator:
The crystal may be eliminated and EXTAL driven directly driven by the external oscillator. The
clock signal level on EXTAL must swing from NVCC_SRTC to GND.
In this configuration, the XTAL pin must be floated and the COSC_EN bit (bit 12 in the CCR
register in the Clock Control Module) must be cleared to put the on-chip oscillator circuit in
bypass mode which allows EXTAL to be externally driven.
Note there are strict jitter requirements if using an external oscillator in a USB application:
< 50 ps peak-to-peak below 1.2 MHz and < 100 ps peak-to-peak above 1.2 MHz for the USB
PHY.
Table 6. i.MX50 Chip-Level Conditions
For these characteristics, see
Topic appears …
Table 5. Special Signal Considerations (continued)
Signal Name
Remarks
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MCIMX508CVK8A | 制造商:Freescale Semiconductor 功能描述:CODEX 13MM W/2025D - Bulk |
| MCIMX508CVK8B | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 Codex 1.1 13mm RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX508CVK8BR2 | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 Codex 1.1 13mm RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX508CVM8B | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 Codex Rev 1.1 RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
| MCIMX508CVM8BR2 | 功能描述:處理器 - 專(zhuān)門(mén)應(yīng)用 Codex Rev 1.1 RoHS:否 制造商:Freescale Semiconductor 類(lèi)型:Multimedia Applications 核心:ARM Cortex A9 處理器系列:i.MX6 數(shù)據(jù)總線(xiàn)寬度:32 bit 最大時(shí)鐘頻率:1 GHz 指令/數(shù)據(jù)緩存: 數(shù)據(jù) RAM 大小:128 KB 數(shù)據(jù) ROM 大小: 工作電源電壓: 最大工作溫度:+ 95 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MAPBGA-432 |
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