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參數(shù)資料
| 型號： | LTC2450IDC-1#TRMPBF |
| 廠商： | Linear Technology |
| 文件頁數(shù)： | 7/20頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 16BIT DELTA SIG 6-DFN |
| 產(chǎn)品培訓模塊： | LTC2460 and LTC2450 Delta Sigma ADC Families |
| 標準包裝： | 1 |
| 位數(shù)： | 16 |
| 采樣率（每秒）： | 30 |
| 數(shù)據(jù)接口： | 串行，SPI? |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 功率耗散（最大）： | 1.05mW |
| 電壓電源： | 單電源 |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 6-WFDFN 裸露焊盤 |
| 供應商設備封裝： | 6-DFN-EP（2x2） |
| 包裝： | 標準包裝 |
| 輸入數(shù)目和類型： | 1 個單端，單極 |
| 產(chǎn)品目錄頁面： | 1348 (CN2011-ZH PDF) |
| 其它名稱： | LTC2450IDC-1#TRMPBFDKR |
LTC2450-1
15
24501fc
APPLICATIONS INFORMATION
Figure 15. LTC2450-1 Input Drive Equivalent Circuit
elements which reduce the ADC performance sensitivity to
PCBlayoutandexternalcomponents.Nevertheless,thevery
high accuracy of this converter is best preserved by careful
low and high frequency power supply decoupling.
A 0.1μF, high quality, ceramic capacitor in parallel with a
10μF ceramic capacitor should be connected between the
VCC and GND pins, as close as possible to the package.
The 0.1μF capacitor should be placed closest to the ADC
package. It is also desirable to avoid any via in the circuit
path starting from the converter VCC pin, passing through
these two decoupling capacitors and returning to the
converter GND pin. The area encompassed by this circuit
path, as well as the path length, should be minimized.
Very low impedance ground and power planes and star
connections at both VCC and GND pins are preferable. The
VCCpinshouldhavetwodistinctconnections:thersttothe
decoupling capacitors described above and the second to
the power supply voltage. The GND pin should have three
distinct connections: the rst to the decoupling capacitors
described above, the second to the ground return for the
input signal source and the third to the ground return for
the power supply voltage source.
Driving VIN
The VIN input drive requirements can be best analyzed
using the equivalent circuit of Figure 15. The input signal
VSIG is connected to the ADC input pin VIN through an
equivalent source resistance RS. This resistor includes
both the actual generator source resistance and any
additional optional resistor connected to the VIN pin. An
optional input capacitor CIN is also connected to the ADC
VIN pin. This capacitor is placed in parallel with the ADC
input parasitic capacitance CPAR. Depending upon the PCB
layout CPAR has typical values between 2pF and 15pF. In
addition, the equivalent circuit of Figure 15 includes the
converter equivalent internal resistor RSW and sampling
capacitor CEQ.
There are some immediate trade-offs in RS and CIN without
needing a full circuit analysis. Increasing RS and CIN can
give the following benets:
1) Due to the LTC2450-1’s input sampling algorithm, the
input current drawn by VIN during the conversion cycle
is 50nA. A high RS CIN attenuates the high frequency
components of the input current, and RS values up to
1kΩ result in <1LSB error.
2) The bandwidth from VSIG is reduced at VIN.This band-
width reduction isolates the ADC from high frequency
signals, and as such provides simple antialiasing and
input noise reduction.
3) Noise generated by the ADC is attenuated before it goes
back to the signal source.
4) A large CIN gives a better AC ground at VIN, helping
reduce reections back to the signal source.
5) Increasing RS protects the ADC by limiting the current
during an outside-the-rails fault condition. RS can be
easily sized such as to protect against even extreme
fault conditions.
There is a limit to how large RS CIN should be for a given
application. Increasing RS beyond a given point increases
the voltage drop across RS due to the input current, to
the point that signicant measurement errors exist. Ad-
ditionally, for some applications, increasing the RS CIN
product too much may unacceptably attenuate the signal
at frequencies of interest.
CEQ
0.35pF
(TYP)
RSW
15k
(TYP)
ILEAK
VCC
RS
CIN
VSIG
CPAR
VCC
ICONV
24501 F15
VIN
+
–
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