參數(shù)資料
型號: KAC-1310
廠商: Electronic Theatre Controls, Inc.
英文描述: 1280 (H) x 1024 (V) SXGA CMOS Image Sensor
中文描述: 1280(高)x 1024(五)SXGA CMOS圖像傳感器
文件頁數(shù): 74/76頁
文件大小: 759K
代理商: KAC-1310
IMAGE SENSOR SOLUTIONS
74
IMAGE SENSOR SOLUTIONS
K A C - 1 3 1 0 R e v 4 w w w . k o d a k . c o m / g o / i m a g e r s 5 8 5 - 7 2 2 - 4 3 8 5 E m a i l : i m a g e r s @ k o d a k . c o m
48 Ceramic LCC - Matrix Format
Metric (mm)
English (mils)
Dimension
Description
Min
Nominal
Max
Min.
Nominal
Max
A
Glass (Thickness)
0.5
0.55
0.6
19.69
21.65
23.62
B
Cavity (Depth)
0.9906
1.1176
1.2446
39.00
44.00
49.00
C
Die - Si (Thickness)
0.705
0.725
0.745
27.76
28.54
29.33
D
Bottom Layer (Thickness)
0.381
0.4318
0.4826
15.00
17.00
19.00
E
Die Attach - bondline (Thickness)
0.0127
0.0254
0.0508
0.50
1.00
2.00
F
Glass Attach - bondline (Thickness)
0.00635
0.0254
0.0508
0.25
1.00
2.00
G
Imager to Lid - outer surface (d)
0.70115
0.9426
1.1777
27.60
37.11
46.37
H
Imager to Lid - inner surface (d)
0.20115
0.3926
0.5777
7.92
15.46
22.74
J
Imager to seating plane - of pkg
1.0987
1.1822
1.2784
43.26
46.54
50.33
A+B+F+DPkg (Th - total)
1.87795
2.1248
2.378
73.93
83.65
93.62
B+D
Base (Th)
1.397
1.5494
1.7018
55.00
61.00
67.00
Reference Notes:
1 mil = 25.4
μ
m
1 mm = 39.37 mil
Table 53: 48 Ceramic LCC – Matrix Format
Figure 30: CLCC-IB package vertical Dimensioning
E - Die Attach thickness
A
B
J
G
C - Die
H
F - Lid Seal thickness
D
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