參數(shù)資料
型號： ISP1181
廠商： NXP Semiconductors N.V.
英文描述： Full-speed Universal Serial Bus Interface Device(全速通用串行總線接口器件)
中文描述： 全速通用串行總線接口設(shè)備（全速通用串行總線接口器件）
文件頁數(shù)： 65/69頁
文件大?。?/td> 1655K
代理商： ISP1181
Philips Semiconductors
ISP1181
Full-speed USB interface
Objective specification
Rev. 01 — 13 March 2000
65 of 69
9397 750 06896
Philips Electronics N.V. 2000. All rights reserved.
Typical dwell time is 4 seconds at 250
°
C. A mildly-activated flux will eliminate the
need for removal of corrosive residues in most applications.
23.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
23.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board
and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top
version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[2]
[3]
[4]
[5]
Table 63: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
Soldering method
Wave
not suitable
not suitable
[2]
Reflow
[1]
suitable
suitable
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS
PLCC
[3]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended
[3] [4]
not recommended
[5]
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1181A 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full-speed Universal Serial Bus peripheral controller
ISP1181ABS 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Full-speed Universal Serial Bus peripheral controller
ISP1181ABS,518 功能描述:USB 接口集成電路 USB 1.1 ADV DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1181ABS,551 功能描述:USB 接口集成電路 USB 1.1 ADVANCED DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1181ABS,557 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
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