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| 型號(hào)： | ISP1161A |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Full-speed Universal Serial Bus single-chip host and device controller |
| 中文描述： | 全速通用串行總線的單芯片主機(jī)和設(shè)備控制器 |
| 文件頁數(shù)： | 130/134頁 |
| 文件大?。?/td> | 587K |
| 代理商： | ISP1161A |
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Philips Semiconductors
ISP1161A
Full-speed USB single-chip host and device controller
Product data
Rev. 03 — 23 December 2004
130 of 134
9397 750 13962
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250
°
C or
265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in
most applications.
22.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time
must be limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°
C.
22.5 Package related soldering information
[1]
For more detailed information on the BGA packages refer to the (LF)BGA Application Note
(AN01026); order a copy from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods
[2]
Table 127: Suitability of surface mount IC packages for wave and reflow soldering
methods
Package
[1]
Soldering method
Wave
not suitable
Reflow
[2]
suitable
BGA, HTSSON..T
[3]
, LBGA, LFBGA, SQFP,
SSOP..T
[3]
, TFBGA, USON, VFBGA
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[5]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[8]
, PMFP
[9]
, WQCCN..L
[8]
not suitable
[4]
suitable
suitable
not recommended
[5][6]
not recommended
[7]
not suitable
suitable
suitable
suitable
not suitable
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ISP1161ABD | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161ABM | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161 | Full-speed Universal Serial Bus single-chip host and device controller |
| ISP1161A1 | Universal Serial Bus single-chip host and device controller |
| ISP1161A1BD | Universal Serial Bus single-chip host and device controller |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ISP1161A1 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Universal Serial Bus single-chip host and device controller |
| ISP1161A1BD | 功能描述:IC USB HOST/DEVICE CTRLR 64-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 控制器 系列:- 標(biāo)準(zhǔn)包裝:4,900 系列:- 控制器類型:USB 2.0 控制器 接口:串行 電源電壓:3 V ~ 3.6 V 電流 - 電源:135mA 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:36-VFQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:36-QFN（6x6） 包裝:* 其它名稱:Q6396337A |
| ISP1161A1BD,118 | 功能描述:USB 接口集成電路 USB1.1 HOST &DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161A1BD,151 | 功能描述:USB 接口集成電路 USB1.1 HOST &DEVICE RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
| ISP1161A1BD,157 | 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20 |
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