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參數(shù)資料
| 型號(hào)： | BU-64743G8-200 |
| 廠商： | DATA DEVICE CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 2 CHANNEL(S), 1M bps, MIL-STD-1553 CONTROLLER, CQFP80 |
| 封裝： | 22.35 X 22.35 MM, 3.30 MM HEIGHT, CERAMIC, QFP-80 |
| 文件頁(yè)數(shù)： | 43/93頁(yè) |
| 文件大?。?/td> | 585K |
| 代理商： | BU-64743G8-200 |
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48
Data Device Corporation
www.ddc-web.com
BU-6474X/6484X/6486X
J-07/05-0
THERMAL MANAGEMENT FOR MICRO-ACE-TE (324-
BALL BGA PACKAGE)
Ball Grid Array (BGA) components necessitate that thermal
management issues be considered early in the design stage for
MIL-STD-1553 terminals. This is especially true if high transmit-
ter duty cycles are expected. The temperature range specified for
DDC's Micro-ACE-TE device refers to the temperature at the
ball, not the case.
All Micro-ACE-TE devices incorporate multiple package connec-
tions which perform the dual function of transceiver circuit
ground and thermal heat sink. Refer to the pinout tables for ther-
mal ball connection locations. It is mandatory that these thermal
FIGURE 17. BALL LOCATIONS FOR MICRO-ACE-TE (324-BALL BGA PACKAGE)
balls be directly soldered to a circuit ground/thermal plane (a cir-
cuit trace is insufficient). Operation without an adequate
ground/thermal plane is not recommended and extended expo-
sure to these conditions may affect device reliability.
The purpose of this ground/thermal plane is to conduct the heat
being generated by the transceivers within the package and con-
duct this heat away from the Micro-ACE-TE. In general, the cir-
cuit ground and thermal (chassis) ground are not the same
ground plane. It is acceptable for these balls to be directly sol-
dered to a ground plane but it must be located in close physical
and thermal proximity ("0.003" pre-preg layer recommended) to
the thermal plane.
V U T R P N M L K J H G F E D C B A
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
BOTTOM VIEW
S/N
D/C
TOP VIEW
ESD and Pin 1 Identifier
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