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參數(shù)資料
| 型號： | AD9854AST |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | XO, clock |
| 英文描述： | CMOS 300 MHz Quadrature Complete-DDS |
| 中文描述： | PLL FREQUENCY SYNTHESIZER, 200 MHz, PQFP80 |
| 封裝： | MS-026BEC, LQFP-80 |
| 文件頁數(shù)： | 34/44頁 |
| 文件大?。?/td> | 433K |
| 代理商： | AD9854AST |
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AD9854
–34–
REV. 0
THERMALLY ENHANCED PACKAGE MOUNTING
GUIDELINES
The following are general recommendations for mounting the
thermally enhanced exposed heat sink package (AD9854ASQ)
to printed circuit boards. The exceptional thermal characteristics of
this package depend entirely upon proper mechanical attachment.
Figure 58 depicts the package from the bottom and shows the
dimensions of the exposed heat sink. A solid conduit of solder
needs to be established between this pad and the surface of
the PCB.
C
O
U
N
TR
Y
14mm
10mm
Figure 58.
Figure 59 depicts a general PCB land pattern for such an exposed
heat sink device. Note that this pattern is for a 64-lead device not
an 80-lead, but the relative shapes and dimensions still apply.
In this land pattern, a solid copper plane exists inside of the
individual lands for device leads. Note also that the solder mask
opening is conservatively dimensioned to avoid any assembly
problems.
SOLDER MASK
OPENING
THERMAL LAND
Figure 59.
The thermal land itself must be able to distribute heat to an even
larger copper plane such as an internal ground plane. Vias must be
uniformly provided over the entire thermal pad to connect to this
internal plane. A proposed via pattern is shown in Figure 60. Via
holes should be small (12 mils, 0.3 mm) such that they can be
plated and plugged. These will provide the mechanical conduit
for heat transfer.
Figure 60.
Finally, a proposed stencil design is depicted for screen solder
placement. Note that if vias are not plugged, wicking will occur
which will displace solder away from the exposed heat sink and
the necessary mechanical bond will not be established.
Figure 61.
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| AD9856AST | CMOS 200 MHz Quadrature Digital Upconverter |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AD9854ASTZ | 功能描述:IC DDS QUADRATURE CMOS 80-LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 直接數(shù)字合成 (DDS) 系列:- 產(chǎn)品變化通告:Product Discontinuance 27/Oct/2011 標準包裝:2,500 系列:- 分辨率（位）:10 b 主 fclk:25MHz 調(diào)節(jié)字寬（位）:32 b 電源電壓:2.97 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應商設備封裝:16-TSSOP 包裝:帶卷 (TR) |
| AD9854ASVZ | 制造商:Analog Devices 功能描述:CMOS 300 MSPS QUADRATURE COMPLETE DDS 制造商:Analog Devices 功能描述:CMOS 300 MSPS QUADRATURE COMPLETE DDS - Trays 制造商:Analog Devices 功能描述:SYNTHESIZER 制造商:Analog Devices 功能描述:Complete DDS Quadrature 300MSPS TQFP80 |
| AD9854PCB | 制造商:AD 制造商全稱:Analog Devices 功能描述:CMOS 300 MSPS Quadrature Complete DDS |
| AD9856 | 制造商:AD 制造商全稱:Analog Devices 功能描述:CMOS 200 MHz Quadrature Digital Upconverter |
| AD9856/PCB | 制造商:Analog Devices 功能描述:Evaluation Board For Digital Up Converter 56 Pin LFCSP Ep 制造商:Analog Devices 功能描述:DGTL UP CNVRTR 56LFCSP - Bulk |
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