參數(shù)資料
型號: XPC850SRCZT80B
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: Communications Controller Hardware Specifications
中文描述: 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256
封裝: PLASTIC, BGA-256
文件頁數(shù): 9/76頁
文件大?。?/td> 403K
代理商: XPC850SRCZT80B
MOTOROLA
MPC850 (Rev. A/B/C) Hardware Specifications
9
Part IV Thermal Characteristics
Table 4-3 shows the thermal characteristics for the MPC850.
Table 4-4 provides power dissipation information.
Table 4-5 provides the DC electrical characteristics for the MPC850.
Table 4-5. DC Electrical Specifications
Table 4-3. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Thermal resistance for BGA
1
1
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
general, refer to AN-1231/D,
Plastic Ball Grid Array Application Note
office.
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 20
°
C above ambient.
Assumes natural convection, a multilayer board with thermal vias
temperature rise of 13
°
C above ambient.
T
J
= T
A
+ (P
D
P
D
= (V
DD
where:
P
I/O
is the power dissipation on pins
available from your local Motorola sales
θ
JA
40
2
2
3
°
C/W
θ
JA
31
3
4
, 1 watt MPC850 dissipation, and a board
°
C/W
θ
JA
24
4
4
4
, 1 watt MPC850 dissipation, and a board
θ
JA
DD
)
) + P
I
I/O
°
C/W
Thermal Resistance for BGA (junction-to-case)
θ
JC
8
°
C/W
Table 4-4. Power Dissipation (P
D
)
Characteristic
Frequency (MHz)
Typical
1
1
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
Maximum
2
2
Unit
Power Dissipation
All Revisions
(1:1) Mode
33
TBD
515
mW
40
TBD
590
mW
50
TBD
725
mW
Characteristic
Symbol
Min
Max
Unit
Operating voltage at 40 MHz or less
VDDH, VDDL,
KAPWR, VDDSYN
3.0
3.6
V
Operating voltage at 40 MHz or higher
VDDH, VDDL,
KAPWR, VDDSYN
3.135
3.465
V
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
VIH
2.0
3.6
V
Input high voltage (all general purpose I/O and peripheral pins)
VIH
2.0
5.5
V
相關(guān)PDF資料
PDF描述
XPC850ZT80B Communications Controller Hardware Specifications
XPC850CZT50B Communications Controller Hardware Specifications
XPC850CZT66B Communications Controller Hardware Specifications
XPC850DECZT50B Communications Controller Hardware Specifications
XPC850DECZT66B Communications Controller Hardware Specifications
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XPC850SRVR50BU 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850SRVR66BU 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850SRVR80BU 功能描述:IC MPU POWERQUICC 80MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點:- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA(25x25) 包裝:托盤
XPC850SRZT50B 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications
XPC850SRZT50BU 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標準包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA(29x29) 包裝:托盤