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參數(shù)資料
| 型號： | UDA1350ATS |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費家電 |
| 英文描述： | IEC 958 audio DAC |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PDSO28 |
| 封裝： | PLASTIC, SSOP-28 |
| 文件頁數(shù)： | 27/32頁 |
| 文件大?。?/td> | 124K |
| 代理商： | UDA1350ATS |
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2000 Mar 29
27
Philips Semiconductors
Preliminary specification
IEC 958 audio DAC
UDA1350ATS
15.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| UDA1351 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:96 kHz IEC 958 audio DAC |
| UDA1351H | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:96 kHz IEC 958 audio DAC |
| UDA1351H/N1,551 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 96 KHZ SPDIF DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| UDA1351H/N1,557 | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 96 KHZ SPDIF DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| UDA1351TS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:96 kHz IEC 958 audio DAC |
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