- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄385861 > SSTU32865 (NXP Semiconductors N.V.) 1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM PDF資料下載
參數(shù)資料
| 型號： | SSTU32865 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM |
| 中文描述： | 1.8伏28位1:2登記緩沖區(qū)的DDR2 RDIMM特別平價(jià) |
| 文件頁數(shù)： | 24/29頁 |
| 文件大?。?/td> | 157K |
| 代理商： | SSTU32865 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁當(dāng)前第24頁第25頁第26頁第27頁第28頁第29頁
9397 750 13799
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Product data sheet
Rev. 02 — 28 September 2004
24 of 29
Philips Semiconductors
SSTU32865
1.8 V DDR registered buffer with parity
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215
°
C to 270
°
C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| SSTU32865EG | Linear Voltage Regulator IC; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No |
| SSTUA32864 | Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:1.8V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO) |
| SSTUA32864EC | Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:2.5V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO) |
| SSTUA32864EG | Linear Voltage Regulator IC; Package/Case:8-MSOP; Current Rating:250mA; Leaded Process Compatible:No; Output Voltage Max:2.8V; Peak Reflow Compatible (260 C):No; Reel Quantity:2500; Voltage Regulator Type:Low Dropout (LDO) |
| SSTVN16859 | 13-bit 1:2 SSTL_2 registered buffer for DDR |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SSTU32865EG | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM |
| SSTU32865ET | 功能描述:寄存器 1.8V 28-BIT REG BUF/PARITY RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
| SSTU32865ET,518 | 功能描述:寄存器 1.8V 28-BIT REG RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
| SSTU32865ET,551 | 功能描述:寄存器 1.8V 28-BIT REG RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
| SSTU32865ET,557 | 功能描述:寄存器 1.8V 28-BIT REG RoHS:否 制造商:NXP Semiconductors 邏輯類型:CMOS 邏輯系列:HC 電路數(shù)量:1 最大時鐘頻率:36 MHz 傳播延遲時間: 高電平輸出電流:- 7.8 mA 低電平輸出電流:7.8 mA 電源電壓-最大:6 V 最大工作溫度:+ 125 C 封裝 / 箱體:SOT-38 封裝:Tube |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。