- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄372063 > RH80530NZ006256 MICROPROCESSOR|32-BIT|CMOS|PGA|478PIN|CERAMIC PDF資料下載
參數(shù)資料
| 型號： | RH80530NZ006256 |
| 英文描述： | MICROPROCESSOR|32-BIT|CMOS|PGA|478PIN|CERAMIC |
| 中文描述： | 微處理器| 32位|的CMOS |美巡賽| 478PIN |陶瓷 |
| 文件頁數(shù)： | 59/89頁 |
| 文件大小： | 1672K |
| 代理商： | RH80530NZ006256 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁第53頁第54頁第55頁第56頁第57頁第58頁當前第59頁第60頁第61頁第62頁第63頁第64頁第65頁第66頁第67頁第68頁第69頁第70頁第71頁第72頁第73頁第74頁第75頁第76頁第77頁第78頁第79頁第80頁第81頁第82頁第83頁第84頁第85頁第86頁第87頁第88頁第89頁
Mobile Intel
Pentium
III Processor-M Datasheet
298340-002
Datasheet
59
5.2
Surface Mount Micro-FCBGA Package
The Mobile Intel Pentium
III
Processor-M will also be available in a surface mount, 479-ball Micro-
FCBGA package. The Low Voltage and Ultra Low Voltage processors will be available only in this
package. Mechanical specifications are shown in Table 37. Figure 25 through Figure 27 illustrate
different views of the package.
The Micro-FCBGA package may have capacitors placed in the area surrounding the die. Since the
die-side capacitors are electrically conductive, and only slightly shorter than the die height, care should
be taken to avoid contacting the capacitors with electrically conductive materials. Doing so may short
the capacitors, and possibly damage the device or render it inactive. The use of an insulating material
between the capacitors and any thermal solution should be considered to prevent capacitor shorting.
Table 37. Micro-FCBGA Package Mechanical Specifications
Symbol
Parameter
Min
Max
Unit
A
Overall height, as delivered (1)
2.27
2.77
mm
A2
Die height
0.854
mm
b
Ball diameter
0.78
mm
D
Package substrate length
34.9
35.1
mm
E
Package substrate width
34.9
35.1
mm
D1
Die length
11.18
mm
E1
Die width
7.19
mm
e
Ball pitch
1.27
mm
N
Ball count
479
each
K
Keep-out outline from edge of package
5
mm
K1
Keep-out outline at corner of package
7
mm
K2
Capacitor keep-out height
-
0.7
mm
S
Package edge to first ball center
1.625
mm
--
Solder ball coplanarity
0.20
mm
Pdie
Allowable pressure on the die for thermal solution
-
689
kPa
W
NOTES:
1.
All dimensions are subject to change.
2.
Overall height as delivered. Values were based on design specifications and tolerances. Final height after
surface mount depends on OEM motherboard design and SMT process.
Package weight
4.5
g
相關PDF資料 |
PDF描述 |
|---|---|
| RH80530NZ009256 | MICROPROCESSOR|32-BIT|CMOS|PGA|478PIN|CERAMIC |
| RH80530WZ014256 | Microprocessor |
| RJ80530GZ009512 | Microprocessor |
| RJ80530LZ800512 | Microprocessor |
| RJ80530MY650256 | MICROPROCESSOR|32-BIT|CMOS|BGA|479PIN|CERAMIC |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| RH80530NZ009256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:MICROPROCESSOR|32-BIT|CMOS|PGA|478PIN|CERAMIC |
| RH80530NZ012256 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RH80530NZ014256 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RH80530WZ004256 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RH80530WZ006256 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Intel 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復。