參數(shù)資料
型號: RD38F1010C0ZTL0
廠商: INTEL CORP
元件分類: 存儲器
英文描述: 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA66
封裝: 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù): 41/70頁
文件大?。?/td> 1223K
代理商: RD38F1010C0ZTL0
3VoltIntel
Advanced+BootBlockFlashMemoryStacked-CSPFamily
Datasheet
41
7.0
SystemDesignConsiderations
Thissectioncontainsinformationthatwouldhavebeencontainedinaproductdesignguidein
earliergenerations.Inanefforttosimplifytheamountofdocumentation,relevantsystemdesign
considerationshavebeencombinedintothisdocument.
7.1
Background
TheIntelAdvanced+BootBlockStackedchipscalepackagecombinesthefeaturesofthe
Advanced+BootBlockflashmemoryarchitecturewithalow-powerSRAMtoachieveanoverall
reductioninsystemboardspace.Thisenablesapplicationstointegratesecuritywithsimple
softwareandhardwareconfigurations,whilealsocombiningthesystemSRAMandflashintoone
commonfootprint.Thissectiondiscusseshowtotakefulladvantageofthe3VoltAdvanced+Boot
BlockStackedChipScalePackage.
7.1.1
Flash+SRAMFootprintIntegration
TheStackedChipScalePackagememorysolutioncanbeusedtoreplaceasubsetofthememory
subsystemwithinadesign.Whereapreviousdesignmayhaveusedtwoseparatefootprintsfor
SRAMandFlash,youcannowreplacewiththeindustry-standardI-balloutoftheStacked-CSP
device.Thisallowsforanoverallreductioninboardspace,whichallowsthedesigntointegrate
boththeflashandtheSRAMintoonecomponent.
7.1.2
Advanced+BootBlockFlashMemoryFeatures
Advanced+BootBlockaddsthefollowingnewfeaturestoIntelAdvancedBootBlock
architecture:
Instant,individualblocklockingprovidessoftware/hardwarecontrolled,independentlocking/
unlockingofanyblockwithzerolatencytoprotectcodeanddata.
A128-bitProtectionRegisterenablessystemsecurityimplementations.
Improved12 Vproductionprogrammingsimplifiesthesystemconfigurationrequiredto
implement12 Vfastprogramming.
CommonFlashInterface(CFI)providescomponentinformationonthechiptoallowsoftware-
independentdeviceupgrades.
FormoreinformationonspecificadvantagesoftheAdvanced+BootBlockFlashMemory,please
see
AP-658DesigningwiththeAdvanced+BootBlockFlashMemoryArchitecture
.
7.2
FlashControlConsiderations
Theflashdeviceisprotectedagainstaccidentalblockerasureorprogrammingduringpower
transitions.Powersupplysequencingisnotrequired,since
thedeviceisindifferentastowhich
powersupply,F-VPPorF-VCC,powers-upfirst.Exampleflashpowersupplyconfigurationsare
shownin
Figure12,“ExamplePowerSupplyConfigurations”onpage 42
.
相關(guān)PDF資料
PDF描述
RD38F1020C0ZBL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F3208C3B70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F3204C3B70 TVS BIDIRECT 400W 18V SMA
RD28F1602C3B70 TVS 400W 20V UNIDIRECT SMA
RD28F1604C3B90 TVS UNI-DIR 9.0V 400W SMA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RD38F1010W0YBQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0YDQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0YTQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0ZBQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)
RD38F1010W0ZDQ0 制造商:NUMONYX 制造商全稱:Numonyx B.V 功能描述:Wireless Flash Memory (W18/W30 SCSP)