參數(shù)資料
型號: RD28F3208C3T90
廠商: INTEL CORP
元件分類: 存儲器
英文描述: 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA66
封裝: 8 X 10 MM, 1.20 MM HEIGHT, SCSP-66
文件頁數(shù): 4/70頁
文件大小: 1223K
代理商: RD28F3208C3T90
Contents
4
Datasheet
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
DCCharacteristics..............................................................................................................26
FlashACCharacteristics....................................................................................................29
FlashACCharacteristics—WriteOperations......................................................................31
FlashEraseandProgramTimings(1).................................................................................31
FlashResetOperations......................................................................................................34
SRAMACCharacteristics—ReadOperations....................................................................35
SRAMACCharacteristics—WriteOperations....................................................................37
SRAMDataRetentionCharacteristics—ExtendedTemperature.......................................39
6.0
MigrationGuideInformation
......................................................................................................40
7.0
SystemDesignConsiderations
..................................................................................................41
7.1
Background.........................................................................................................................41
7.1.1
Flash+SRAMFootprintIntegration ......................................................................41
7.1.2
Advanced+BootBlockFlashMemoryFeatures ...................................................41
7.2
FlashControlConsiderations .............................................................................................41
7.2.1
F-RP#ConnectedtoSystemReset.......................................................................42
7.2.2
F-VCC,F-VPPandF-RP#Transition....................................................................42
7.3
NoiseReduction .................................................................................................................43
7.4
SimultaneousOperation.....................................................................................................44
7.4.1
SRAMOperationduringFlash“Busy” ...................................................................45
7.4.2
SimultaneousBusOperations ...............................................................................45
7.5
PrintedCircuitBoardNotes................................................................................................45
7.6
SystemDesignNotesSummary.........................................................................................45
AppendixAProgram/EraseFlowcharts
.............................................................................................46
AppendixBCFIQueryStructure
........................................................................................................52
AppendixCWord-WideMemoryMapDiagrams
...............................................................................59
AppendixDDeviceIDTable
................................................................................................................62
AppendixEProtectionRegisterAddressing
.....................................................................................63
AppendixFMechanicalandShippingMediaDetails
........................................................................64
AppendixGAdditionalInformation
....................................................................................................68
AppendixHOrderingInformation
.......................................................................................................69
相關PDF資料
PDF描述
RD28F1602C3BD70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F1604C3BD70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD38F1010C0ZTL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD38F1020C0ZBL0 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
RD28F3208C3B70 3 VOLT INTEL Advanced+BootBlock FlashMemory(C3)Stacked-ChipScalPackageFamilye
相關代理商/技術參數(shù)
參數(shù)描述
RD28F6408W30B70 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30)
RD28F6408W30B85 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30)
RD28F6408W30T70 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30)
RD28F6408W30T85 制造商:INTEL 制造商全稱:Intel Corporation 功能描述:1.8 Volt Intel Wireless Flash Memory with 3 Volt I/O and SRAM (W30)
RD28S-6/206708 功能描述:BLWR DUAL CENT 470X378MM 230VAC RoHS:是 類別:風扇,熱管理 >> 風扇 - AC 系列:RD28S 其它有關文件:Declaration of Conformity 標準包裝:1 系列:- 氣流:- 軸承類型:- 風扇類型:- 特點:- 雜訊:- 功率(瓦特):- RPM:- 尺寸/尺寸:- 靜態(tài)壓力:- 端子:- 電壓 - 額定:- 重量:- 額定電流:- 預期壽命:- 工作溫度:- 電壓范圍:- 其它名稱:Q5464961