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參數(shù)資料
| 型號(hào)： | ORT82G5-3F680C |
| 廠商： | Lattice Semiconductor Corporation |
| 文件頁數(shù)： | 106/119頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FPSC TRANSCEIVER 8CH 680-BGA |
| 產(chǎn)品變化通告： | Product Discontinuation 01/Aug/2011 |
| 標(biāo)準(zhǔn)包裝： | 24 |
| 系列： | * |
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Lattice Semiconductor
ORCA ORT42G5 and ORT82G5 Data Sheet
87
Package Information
Package Pinouts
Table 43 provides the number of user-programmable I/Os available for each package.
Table 43. I/O Summary
Table 44 and Table 45 provide the package pin and pin function for the ORT42G5 and ORT82G5 FPSC and pack-
ages. The bond pad name is identied in the PIO nomenclature used in the ispLEVER System software design edi-
tor. The Bank column provides information as to which output voltage level bank the given pin is in. The Group
column provides information as to the group of pins the given pin is in. This is used to show which VREF pin is used
to provide the reference voltage for single-ended limited-swing I/Os. If none of these buffer types (such as SSTL,
GTL, HSTL) are used in a given group, then the VREF pin is available as an I/O pin.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specic die, it is indicated as a note in the device column for
the FPGA. The tables provide no information on unused pads.
As shown in the pair columns in Table 38, differential pairs and physical locations are numbered within each bank
(e.g., L19C-A0 is the nineteenth pair in an associated bank). A ‘C’ indicates complementary differential, whereas a
‘T’ indicates true differential. An _A0 indicates the physical location of adjacent balls in either the horizontal or ver-
tical direction. Other physical indicators are as follows:
_A1 indicates one ball between pairs.
_A2 indicates two balls between pairs.
_D0 indicates balls are diagonally adjacent.
_D1 indicates balls are diagonally adjacent, separated by one physical ball.
VREF pins, shown in the Pin Description columns in Table 44 and Table 45, are associated to the bank and group
(e.g., VREF_TL_01 is the VREF for group one of the Top Left (TL) bank.
Device
ORT42G5
ORT82G5
User programmable I/O
204
372
Available programmable differential pair pins
166
330
FPGA conguration pins
7
FPGA dedicated function pins
2
Core function pins
32
71
VDD15
49
63
VDD33
8
10
VDDIO
34
32
VSS
112
91
VDDGB
2
VDDIB
4
8
VDDOB
8
12
VDD_ANA
22
8
No connect
0
2
Total package pins
484
680
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| ORT82G5-3FN680C | 功能描述:FPGA - 現(xiàn)場可編程門陣列 ORCA FPSC 1.5V 3.7 G b Bpln Xcvr 643K Gt RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-3FN680C1 | 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 372 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256 |
| ORT82G5-FPSC-EV | 功能描述:可編程邏輯 IC 開發(fā)工具 Ev Eval Brd RoHS:否 制造商:Altera Corporation 產(chǎn)品:Development Kits 類型:FPGA 工具用于評(píng)估:5CEFA7F3 接口類型: 工作電源電壓: |
| ORT82G5-G2-PAC-EV | 功能描述:可編程邏輯 IC 開發(fā)工具 ORT82G5 ispGDX256 is pPAC PwrMgr 1208 BC RoHS:否 制造商:Altera Corporation 產(chǎn)品:Development Kits 類型:FPGA 工具用于評(píng)估:5CEFA7F3 接口類型: 工作電源電壓: |
| ORT8850 | 制造商:LATTICE 制造商全稱:Lattice Semiconductor 功能描述:Field-Programmable System Chip (FPSC) Eight-Channel x 850 Mbits/s Backplane Transceiver |
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