參數(shù)資料
型號(hào)： MSC7119VM1200
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 53/60頁(yè)
文件大?。?/td> 0K
描述： DSP 16BIT W/DDR CTRLR 400-MAPBGA
標(biāo)準(zhǔn)包裝： 90
系列： StarCore
類(lèi)型： 定點(diǎn)
接口： 主機(jī)接口，I²C，UART
時(shí)鐘速率： 300MHz
非易失內(nèi)存： ROM（8 kB）
芯片上RAM： 464kB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.20V
工作溫度： -40°C ~ 105°C
安裝類(lèi)型： 表面貼裝
封裝/外殼： 400-LFBGA
供應(yīng)商設(shè)備封裝： 400-MAPBGA（17x17）
包裝： 托盤(pán)
Ordering Information
MSC7119 Data Sheet, Rev. 8
Freescale Semiconductor
57
3.6
Connectivity Guidelines
This section summarizes the connections and special conditions, such as pull-up or pull-down resistors, for the MSC7119
device. Following are guidelines for signal groups and configuration settings:
Clock and reset signals.
— SWTE is used to configure the MSC7119 device and is sampled on the deassertion of PORESET, so it should be
tied to VDDC or GND either directly or through pull-up or pull-down resistors until PORESET is deasserted. After
PORESET
, this signal can be left floating.
— BM[0–1] configure the MSC7119 device and are sampled until PORESET is deasserted, so they should be tied to
VDDIO or GND either directly or through pull-up or pull-down resistors.
— HRESET should be pulled up.
Interrupt signals. When used, IRQ pins must be pulled up.
HDI16 signals.
— When they are configured for open-drain, the HREQ/HREQ or HTRQ/HTRQ signals require a pull-up resistor.
However, these pins are also sampled at power-on reset to determine the HDI16 boot mode and may need to be
pulled down. When these pins must be pulled down on reset and pulled up otherwise, a buffer can be used with
the HRESET signal as the enable.
— When the device boots through the HDI16, the HDDS, HDSP and H8BIT pins should be pulled up or down,
depending on the required boot mode settings.
Ethernet MAC/TDM2 signals. The MDIO signal requires an external pull-up resistor.
I2C signals. The SCL and SDA signals, when programmed for I2C, requires an external pull-up resistor.
General-purpose I/O (GPIO) signals. An unused GPIO pin can be disconnected. After boot, program it as an output
pin.
Other signals.
—The TEST0 pin must be connected to ground.
—The TPSEL pin should be pulled up to enable debug access via the EOnCE port and pulled down for boundary
scan.
— Pins labelled NO CONNECT (NC) must not be connected.
— When a 16-pin double data rate (DDR) interface is used, the 16 unused data pins should be no connects (floating)
if the used lines are terminated.
— Do not connect DBREQ to DONE (as you would for the MSC8101 device). Connect DONE to one of the EVNT
pins, and DBREQ to HRRQ.
4
Ordering Information
Consult a Freescale Semiconductor sales office or authorized distributor to determine product availability and place an order.
Part
Supply Voltage
Package Type
Pin
Count
Core
Frequency
(MHz)
Solder Spheres
Order Number
MSC7119
1.2 V core
2.5 V memory
3.3 V I/O
Molded Array Process-Ball Grid
Array (MAP-BGA)
400
300
Lead-free
MSC7119VM1200
Lead-bearing
MSC7119VF1200
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