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| 型號： | MPC603RVG300LC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 22/31頁 |
| 文件大?。?/td> | 0K |
| 描述： | MPU RISC PID7V-603E 255FCCBGA |
| 標準包裝： | 60 |
| 系列： | MPC6xx |
| 處理器類型： | 32-位 MPC603e PowerPC |
| 速度： | 300MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 255-BCBGA 裸露焊盤，255-FCCBGA |
| 供應(yīng)商設(shè)備封裝： | 255-FCCBGA（21x21） |
| 包裝： | 托盤 |
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PID7t-603e Hardware Specifications, Rev. 5
Freescale Semiconductor
29
Ordering Information
Tj = 30°C + 5°C + (8 °C/W +1.0 °C/W + 7 °C/W) * 3.0 W,
Eqn. 4
resulting in a die-junction temperature of approximately 83 °C that is well within the maximum operating
temperature of the component. Commercially available heat sinks have different heat sink-to-ambient
thermal resistances, and may or may not need air flow.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the
system-level design and its operating conditions. In addition to the component’s power consumption, a
number of factors affect the final operating die-junction temperature—airflow, board population (local
heat flux of adjacent components), heat sink efficiency, heat sink attach, heat sink placement, next-level
interconnect technology, system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as, system-level designs. To expedite system-level thermal analysis, several
“compact” thermal-package models are available within FLOTHERM. These are available upon
request.
9
Ordering Information
This figure provides the part numbering nomenclature for the PID7t-603e. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Freescale sales office.
In addition to the processor frequency, the part numbering scheme also consists of a part modifier and
application modifier. The part modifier indicates any enhancement(s) in the part from the original design.
The application modifier may specify special bus frequencies or application conditions. Each part number
also contains a revision code. This refers to the die mask revision number and is specified in the part
numbering scheme for identification purposes only.
Figure 19. Part Number Key
MPC 603 R RX XXX X X
Product Code
Part Identifier
Part Modifier
Application Modifier
(R = Remapped, Enhanced, Low-Voltage)
(L = Any Valid PLL Configuration)
Package
Processor Frequency
(Contact Freescale Sales Office)
Revision Level
(RX = CBGA without Lid)
(T = Extended Termperature Range)
(ZT = PBGA Package)
(VG = Polymer Core CBGA without Lid)
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