參數(shù)資料
型號: MPC603RVG300LC
廠商: Freescale Semiconductor
文件頁數(shù): 13/31頁
文件大?。?/td> 0K
描述: MPU RISC PID7V-603E 255FCCBGA
標準包裝: 60
系列: MPC6xx
處理器類型: 32-位 MPC603e PowerPC
速度: 300MHz
電壓: 2.5V
安裝類型: 表面貼裝
封裝/外殼: 255-BCBGA 裸露焊盤,255-FCCBGA
供應(yīng)商設(shè)備封裝: 255-FCCBGA(21x21)
包裝: 托盤
PID7t-603e Hardware Specifications, Rev. 5
20
Freescale Semiconductor
System Design Information
Figure 12. Package Dimensions for the Plastic Ball Grid Array (PBGA)—JEDEC Standard
Note that the pin numberings shown in Figure 12 do not match Table 11; the pinout of the non-JEDEC
standard package (and the CBGA pinout) is shown in Figure 11. Note that Figure 11 should be used in
conjunction with Table 11 for the complete pinout description.
8
System Design Information
This section provides electrical and thermal design recommendations for successful application of 603e.
U
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
256X
BOTTOM VIEW
E
0.20
7
6
5
4
3
2
b
0.15
C
D
D2
E2
A
B
0.30
C AB
SIDE VIEW
DIM
MIN
MAX
MILLIMETERS
A
2.10
2.60
A1
0.50
0.70
A2
1.10
1.20
A3
0.50
0.70
b
0.60
0.90
D
23.00 BSC
D1
19.05 REF
D2
E
23.00 BSC
E1
19.05 REF
E2
19.40
19.60
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2.
DIMENSIONS IN MILLIMETERS.
3.
DIMENSION b IS MEASURED AT THE MAXIMUM
SOLDER BALL DIAMETER, PARALLEL TO PRIMARY
DATUM C.
4.
PRIMARY DATUM C AND THE SEATING PLANE ARE
4X
8 9 10 11 12 13 14 15 16
M
TOP VIEW
(D1)
15X
e
15X
e
(E1)
4X
e /2
0.20 C
0.35 C
A3
256X
C
A
A1
A2
SEATING
PLANE
e
1.27 BSC
19.40
19.60
17
CASE 1167-01
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