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| 型號： | MPC603RVG300LC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 21/31頁 |
| 文件大?。?/td> | 0K |
| 描述： | MPU RISC PID7V-603E 255FCCBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | MPC6xx |
| 處理器類型： | 32-位 MPC603e PowerPC |
| 速度： | 300MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 255-BCBGA 裸露焊盤，255-FCCBGA |
| 供應(yīng)商設(shè)備封裝： | 255-FCCBGA（21x21） |
| 包裝： | 托盤 |
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PID7t-603e Hardware Specifications, Rev. 5
28
Freescale Semiconductor
System Design Information
During operation the die-junction temperatures (Tj) should be maintained less than the value specified in
Table 3. The temperature of the air cooling the component greatly depends upon the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (Ta) may range from 30 to 40 °C. The air temperature rise within a cabinet (Tr) may be in the
range of 5 to 10 °C. The thermal resistance of the thermal interface material (
int) is typically about
1 °C/W. Assuming a Ta of 30 °C, a Tr of 5 °C a CBGA package jc = 0.095, and a power consumption (Pd)
of 3.0 Watts, the following expression for Tj is obtained:
Die-junction temperature: Tj = 30 °C + 5 °C + (0.095 °C/W + 1.0 °C/W + Rsa) * 3.0 W. For example, the
heat sink-to-ambient thermal resistance (Rsa) versus airflow velocity is shown in this figure.
Figure 18. Example of Heat Sink-to-Ambient Thermal Resistance Versus Airflow Velocity
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
Tj = 30°C + 5°C + (0.095 °C/W +1.0 °C/W + 7 °C/W) * 3.0 W,
Eqn. 2
resulting in a die-junction temperature of approximately 60 °C which is well within the maximum
operating temperature of the component.
For a PBGA package, and assuming a Ta of 30 °C, a Tr of 5 °C a PBGA package jc = 8, and a power
consumption (Pd) of 3.0 Watts, the following expression for die-junction temperature, Tj, is obtained as:
Tj = 30 °C + 5 °C + (8 °C/W + 1.0 °C/W + Rsa) * 3.0 W
Eqn. 3
Assuming an air velocity of 0.5 m/s, we have an effective Rsa of 7 °C/W, thus
1
3
5
7
8
00.511.522.5
33.5
Example: Pin-fin Heat Sink
Approach Air Velocity (m/s)
Hea
tSink
The
rmal
Resistance
(C/W)
(25x28 x15mm)
2
4
6
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