參數(shù)資料
型號(hào)： MPC603RVG300LC
廠商： Freescale Semiconductor
文件頁(yè)數(shù)： 19/31頁(yè)
文件大小： 0K
描述： MPU RISC PID7V-603E 255FCCBGA
標(biāo)準(zhǔn)包裝： 60
系列： MPC6xx
處理器類型： 32-位 MPC603e PowerPC
速度： 300MHz
電壓： 2.5V
安裝類型： 表面貼裝
封裝/外殼： 255-BCBGA 裸露焊盤，255-FCCBGA
供應(yīng)商設(shè)備封裝： 255-FCCBGA（21x21）
包裝： 托盤
PID7t-603e Hardware Specifications, Rev. 5
26
Freescale Semiconductor
System Design Information
8.6.1
Internal Package Conduction Resistance
For this packaging technology, the intrinsic thermal conduction resistance (as shown in Table 3) versus the
external thermal resistance paths are shown in this figure for a package with an attached heat sink mounted
to a PCB.
Figure 16. Package with Heat Sink Mounted to a Printed-Circuit Board
8.6.2
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism, as shown in Figure 17. The thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure. As shown, the performance of these thermal interface materials improves with
increasing contact pressure. The use of thermal grease significantly reduces the interface thermal
resistance. That is, the bare joint results in a thermal resistance approximately seven times greater than the
thermal grease joint. Therefore, the synthetic grease offers the best thermal performance, considering the
low-interface pressure. Of course, the selection of any thermal interface material depends on many
factors—thermal performance requirements, manufacturability, service temperature, dielectric properties,
cost, etc.
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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