參數(shù)資料
型號: MC68HC705C9ACP
廠商: MOTOROLA INC
元件分類: 微控制器/微處理器
英文描述: Microcontrollers
中文描述: 8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP40
封裝: PLASTIC, DIP-40
文件頁數(shù): 149/160頁
文件大?。?/td> 2076K
代理商: MC68HC705C9ACP
Mechanical Specifications
44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
MC68HC705C9A — Rev. 4.0
Advance Information
MOTOROLA
Mechanical Specifications
For More Information On This Product,
Go to: www.freescale.com
149
13.5 44-Lead Plastic Leaded Chip Carrier (PLCC) (Case 777-02)
Figure 13-3. 44-Lead PLCC (Case 777-02)
-N-
-L-
-M-
D
Y
D
K
V
W
1
44
BRK
B
Z
U
X
VIEW D-D
S
L-M
M
0.007(0.180)
N S
T
S
L-M
M
0.007(0.180)
N S
T
G1
0.010 (0.25)
S
L-M
S
N S
T
K1
F
H
S
L-M
M
0.007(0.180)
N S
T
Z
G
G1
S
R
A
E
J
VIEW S
C
S
L-M
M
0.007(0.180)
N S
T
S
L-M
M
0.007(0.180)
N S
T
0.004 (0.10)
-T-
SEATING
PLANE
VIEW S
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
MIN
0.685
0.685
0.165
0.090
0.013
0.050 BSC
0.026
0.020
0.025
0.650
0.650
0.042
0.042
0.042
MAX
0.695
0.695
0.180
0.110
0.019
MIN
17.40
17.40
4.20
2.29
0.33
MAX
17.65
17.65
4.57
2.79
0.48
MILLIMETERS
INCHES
1.27 BSC
0.66
0.51
0.64
16.51
16.51
1.07
1.07
1.07
0.032
0.81
0.656
0.656
0.048
0.048
0.056
0.020
10
°
0.630
16.66
16.66
1.21
1.21
1.42
0.50
10
°
2
°
0.610
0.040
15.50
1.02
16.00
S
L-M
0.010 (0.25)
N S
T
S
L-M
M
0.007(0.180)
N S
T
2
°
NOTES:
1.DATUMS -L-, -M-, AND -N- ARE DETERMINED
WHERE TOP OF LEAD SHOLDERS EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2.DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM-T-, SEATING PLANE.
3.DIMENSION R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010
(0.25) PER SIDE.
4.DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M 1982.
5.CONTROLLING DIMENSION: INCH.
6.THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOMBY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE DETER-
MINED
AT THE OUTERMOST EXTREMES OF THE
PLASTIC BODY EXCLUSIVE OF THE MOLD
FLASH, TIE BAR BURRS, GATE BURRS AND
INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM
OF THE PLASTIC BODY.
7.DIMINSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTUSION(S) SHALL NOT CAUSE THE H
DIMINSION TO BE GREATER THAN 0.037
(0.940150). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMINISION TO SMALLER
THAN 0.025 (0.635).
F
Freescale Semiconductor, Inc.
n
.
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