- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄11654 > MC56F8014VFAE (Freescale Semiconductor)IC DIGITAL SIGNAL CTRLR 32-LQFP PDF資料下載
參數(shù)資料
| 型號(hào)： | MC56F8014VFAE |
| 廠商： | Freescale Semiconductor |
| 文件頁(yè)數(shù)： | 26/124頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC DIGITAL SIGNAL CTRLR 32-LQFP |
| 標(biāo)準(zhǔn)包裝： | 250 |
| 系列： | 56F8xxx |
| 核心處理器： | 56800E |
| 芯體尺寸： | 16-位 |
| 速度： | 32MHz |
| 連通性： | I²C，SCI，SPI |
| 外圍設(shè)備： | POR，PWM，WDT |
| 輸入/輸出數(shù)： | 26 |
| 程序存儲(chǔ)器容量： | 16KB（8K x 16） |
| 程序存儲(chǔ)器類型： | 閃存 |
| RAM 容量： | 2K x 16 |
| 電壓 - 電源 (Vcc/Vdd)： | 3 V ~ 3.6 V |
| 數(shù)據(jù)轉(zhuǎn)換器： | A/D 8x12b |
| 振蕩器型： | 內(nèi)部 |
| 工作溫度： | -40°C ~ 105°C |
| 封裝/外殼： | 32-LQFP |
| 包裝： | 托盤 |
| 配用： | DEMO56F8014-E-ND - BOARD DEMO MC56F8014 W/UNIV PS DEMO56F8014-ND - BOARD DEMO MC56F8014 W/US PS APMOTOR56F8000E-ND - KIT DEMO MOTOR CTRL SYSTEM DEMO56F8014-EE-ND - BOARD DEMO FOR 56F8014 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)當(dāng)前第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)
Electrical Design Considerations
56F8014 Technical Data, Rev. 11
Freescale Semiconductor
121
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over about 1mm of wire extending from the junction. The thermocouple wire
is placed flat against the package case to avoid measurement errors caused by cooling effects of the
thermocouple wire.
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back-calculate the case temperature using a separate measurement of the thermal resistance of the
interface. From this case temperature, the junction temperature is determined from the junction-to-case
thermal resistance.
12.2 Electrical Design Considerations
Use the following list of considerations to assure correct operation of the 56F8014:
Provide a low-impedance path from the board power supply to each VDD pin on the 56F8014 and from the
board ground to each VSS (GND) pin
The minimum bypass requirement is to place 0.01–0.1
μF capacitors positioned as close as possible to the
package supply pins. The recommended bypass configuration is to place one bypass capacitor on each of
the VDD/VSS pairs, including VDDA/VSSA. Ceramic and tantalum capacitors tend to provide better
tolerances.
Ensure that capacitor leads and associated printed circuit traces that connect to the chip VDD and VSS (GND)
pins are as short as possible
Bypass the VDD and VSS with approximately 100μF, plus the number of 0.1μF ceramic capacitors
Ψ
JT
=
Thermal characterization parameter (oC/W)
PD
=
Power dissipation in package (W)
CAUTION
This device contains protective circuitry to guard
against damage due to high static voltage or electrical
fields. However, normal precautions are advised to
avoid
application
of
any
voltages
higher
than
maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are
tied to an appropriate voltage level.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| V24C24M100B2 | CONVERTER MOD DC/DC 24V 100W |
| MC9S08DV32AMLF | IC MCU 32K FLASH 2K RAM 48-LQFP |
| MC9S08DN60CLF | IC MCU 60K FLASH 2K RAM 48-LQFP |
| V24C15M100BL | CONVERTER MOD DC/DC 15V 100W |
| V24C15M100BG3 | CONVERTER MOD DC/DC 15V 100W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC56F8023 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| MC56F8023VLC | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
| MC56F8025 | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers |
| MC56F8025E | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Digital Signal Controller Product Brief |
| MC56F8025MLD | 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 16 BIT DSPHC RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。