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參數(shù)資料
| 型號(hào)： | MC10H186 |
| 廠商： | ON SEMICONDUCTOR |
| 英文描述： | Hex D Master Slave Flip Flop with Reset(六D主從觸發(fā)器（帶復(fù)位）) |
| 中文描述： | 六角?主從拖鞋與復(fù)位（六?主從觸發(fā)器（帶復(fù)位）） |
| 文件頁數(shù)： | 5/5頁 |
| 文件大?。?/td> | 149K |
| 代理商： | MC10H186 |
MC10H186
http://onsemi.com
5
PACKAGE DIMENSIONS
CDIP
16
L SUFFIX
CERAMIC DIP PACKAGE
CASE 620A
01
ISSUE O
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
5
THIS DRAWING REPLACES OBSOLETE
CASE OUTLINE 62010.
F
E
N
K
C
SEATING
PLANE
A
M
0.25 (0.010)
T
M
L
DIM
A
B
C
D
E
F
G
H
K
L
M
N
MIN
0.750
0.240
0.015
0.050 BSC
0.055
0.100 BSC
0.008
0.125
0.300 BSC
0
0.020
MAX
0.785
0.295
0.200
0.020
MIN
19.05
6.10
0.39
MAX
19.93
7.49
5.08
0.50
MILLIMETERS
INCHES
1.27 BSC
1.40
2.54 BSC
0.21
3.18
7.62 BSC
0
0.51
0.065
1.65
0.015
0.170
0.38
4.31
15
15
1.01
0.040
A
B
B
16
1
9
8
G
16X
D
B
M
0.25 (0.010)
T
T
16X
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
PLANE
1
8
9
16
K
T
M
A
M
0.25 (0.010)
T
DIM
A
B
C
D
F
G
H
J
K
L
M
S
MIN
0.740
0.250
0.145
0.015
0.040
0.100 BSC
0.050 BSC
0.008
0.110
0.295
0
0.020
MAX
0.770
0.270
0.175
0.021
0.70
MIN
18.80
6.35
3.69
0.39
1.02
MAX
19.55
6.85
4.44
0.53
1.77
MILLIMETERS
INCHES
2.54 BSC
1.27 BSC
0.21
2.80
7.50
0
0.51
0.015
0.130
0.305
10
0.040
0.38
3.30
7.74
10
1.01
PDIP
16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648
08
ISSUE R
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MC10H186FN | 功能描述:觸發(fā)器 Hexadecimal D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC10H186FNG | 功能描述:觸發(fā)器 Hexadecimal D-Type Master-Slave w/Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC10H186FNR2 | 功能描述:觸發(fā)器 Hexadecimal D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC10H186FNR2G | 功能描述:觸發(fā)器 Hexadecimal D-Type Master-Slave w/Reset RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
| MC10H186L | 功能描述:觸發(fā)器 Hexadecimal D-Type RoHS:否 制造商:Texas Instruments 電路數(shù)量:2 邏輯系列:SN74 邏輯類型:D-Type Flip-Flop 極性:Inverting, Non-Inverting 輸入類型:CMOS 輸出類型: 傳播延遲時(shí)間:4.4 ns 高電平輸出電流:- 16 mA 低電平輸出電流:16 mA 電源電壓-最大:5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:X2SON-8 封裝:Reel |
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