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參數(shù)資料
| 型號(hào)： | MAXADCLITE+ |
| 廠商： | Maxim Integrated Products |
| 文件頁數(shù)： | 12/22頁 |
| 文件大?。?/td> | 0K |
| 描述： | KIT EVALUATION FOR MAX11645 |
| 產(chǎn)品培訓(xùn)模塊： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 標(biāo)準(zhǔn)包裝： | 1 |
| ADC 的數(shù)量： | 1 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 94.4k |
| 數(shù)據(jù)接口： | USB |
| 輸入范圍： | ±VREF/2 |
| 工作溫度： | -40°C ~ 85°C |
| 已用 IC / 零件： | MAX11645 |
| 已供物品： | 板，軟件 |
MAX11644/MAX11645
Low-Power, 1-/2-Channel, I2C, 12-Bit ADCs
in Ultra-Tiny 1.9mm x 2.2mm Package
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = 2.7V to 3.6V (MAX11645), VDD = 4.5V to 5.5V (MAX11644), VREF = 2.048V (MAX11645), VREF = 4.096V (MAX11644),
fSCL = 1.7MHz, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C, see Tables 1–5 for programming
notation.) (Note 1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
AIN0, AIN1, REF to GND ..............................-0.3V to the lower of
(VDD + 0.3V) and 6V
SDA, SCL to GND.....................................................-0.3V to +6V
Maximum Current into Any Pin .........................................±50mA
Continuous Power Dissipation (TA = +70°C)
8-Pin μMAX (derate 4.5mW/°C above +70°C) ..............362mW
12-Pin WLP (derate 16.1mW/°C above +70°C) ..........1288mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-60°C to +150°C
Lead Temperature (soldering, 10s)
μMAX only .....................................................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 2)
Resolution
12
Bits
Relative Accuracy
INL
(Note 3)
±1
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1
LSB
Offset Error
±4
LSB
Offset-Error Temperature
Coefficient
Relative to FSR
0.3
ppm/°C
Gain Error
(Note 4)
±4
LSB
Gain-Temperature Coefficient
Relative to FSR
0.3
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
Channel-to-Channel Gain
Matching
±0.1
LSB
DYNAMIC PERFORMANCE (fIN(SINE-WAVE) = 10kHz, VIN(P-P) = VREF, fSAMPLE = 94.4ksps)
Signal-to-Noise Plus Distortion
SINAD
70
dB
Total Harmonic Distortion
THD
Up to the 5th harmonic
-78
dB
Spurious-Free Dynamic Range
SFDR
78
dB
Full-Power Bandwidth
SINAD > 68dB
3
MHz
Full-Linear Bandwidth
-3dB point
5
MHz
CONVERSION RATE
Internal clock
7.5
Conversion Time (Note 5)
tCONV
External clock
10.6
μs
Internal clock, SCAN[1:0] = 01
51
Throughput Rate
fSAMPLE
External clock
94.4
ksps
Track/Hold Acquisition Time
800
ns
Internal Clock Frequency
2.8
MHz
External clock, fast mode
60
Aperture Delay (Note 6)
tAD
External clock, high-speed mode
30
ns
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