參數(shù)資料
型號(hào)： MAX199BMYI
廠商： MAXIM INTEGRATED PRODUCTS INC
元件分類： 模擬信號(hào)調(diào)理
英文描述： Multi-Range (【4V, 【2V, +4V, +2V), +5V Supply, 12-Bit DAS with 8+4 Bus Interface
中文描述： SPECIALTY ANALOG CIRCUIT, CDIP28
封裝： 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-28
文件頁數(shù)： 15/16頁
文件大?。?/td> 165K
代理商： MAX199BMYI
T ransfer Func tion
Output data coding for the MAX199 is binary in unipolar
mode with 1LSB = (FS / 4096) and twos-complement
binary in bipolar mode with 1LSB = [(2 x
|
FS
|
) / 4096].
Code transitions occur halfway between successive-
integer LSB values. Figures 10 and 11 show the
input/output (I/O) transfer functions for unipolar and
bipolar operations, respectively.
Layout, Grounding, and Bypassing
Careful printed circuit board layout is essential for best
system performance. For best performance, use a
ground plane. To reduce crosstalk and noise injection,
keep analog and digital signals separate. Digital
ground lines can run between digital signal lines to
minimize interference. Connect analog grounds and
DGND in a star configuration to AGND. For noise-free
operation, ensure the ground return from AGND to the
supply ground is low impedance and as short as possi-
ble. Connect the logic grounds directly to the supply
ground. Bypass V
DD
with 0.1μF and 4.7μF capacitors
to AGND to minimize high- and low-frequency fluctua-
tions. If the supply is excessively noisy, connect a 5
resistor between the supply and V
DD
, as shown in
Figure 12.
M
Multi-Range (±4V, ±2V, +4V, +2V ),
+5V S upply, 12-Bit DAS with 8+4 Bus Interfac e
______________________________________________________________________________________
15
_Ordering Information (c ontinued)
28 Narrow Ceramic SB**
-55°C to +125°C
MAX199BMYI
**Contact factory for availability and processing to MIL-STD-883.
28 Narrow Ceramic SB**
-55°C to +125°C
MAX199AMYI
28 SSOP
-40°C to +85°C
MAX199BEAI
28 SSOP
-40°C to +85°C
MAX199AEAI
28 Wide SO
-40°C to +85°C
MAX199BEWI
28 Wide SO
28 Narrow Plastic DIP
28 Narrow Plastic DIP
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
MAX199AEWI
MAX199BENI
MAX199AENI
PIN-PACKAGE
TEMP. RANGE
PART
V
DD
GND
DGND
DGND
AGND
+5V
+5V
SUPPLY
R* = 5
DIGITAL
CIRCUITRY
4.7
μ
F
0.1
μ
F
** CONNECT AGND AND DGND WITH A GROUND PLANE OR A SHORT TRACE
MAX199
**
Figure 12. Power-Supply Grounding Connection
TRANSISTOR COUNT: 2956
SUBSTRATE CONNECTED TO GND
___________________Chip Topography
CH5
CH6
CH7
INT
REFADJ
0.231"
(5.870mm)
0.144"
(3.659mm)
D2
CH0
CH1
D0
D1
AGND
CH4
CH3
CH2
V
CC
V
DD
REF
DGND
CLK
WR
CS
RD
HBEN
SHDN
D7
D6
D5
D4
D3
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