- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄383333 > MAX1714 (Maxim Integrated Products, Inc.) High-Speed Step-Down Controller for Notebook Computers PDF資料下載
參數(shù)資料
| 型號(hào)： | MAX1714 |
| 廠商： | Maxim Integrated Products, Inc. |
| 英文描述： | High-Speed Step-Down Controller for Notebook Computers |
| 中文描述： | 高速、降壓型控制器，用于筆記本電腦 |
| 文件頁(yè)數(shù)： | 21/24頁(yè) |
| 文件大小： | 443K |
| 代理商： | MAX1714 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)當(dāng)前第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)
where a single milliohm of excess trace resistance
causes a measurable efficiency penalty.
LX and PGND connections to Q2 for current limiting
must be made using Kelvin sense connections to
guarantee the current-limit accuracy. With SO-8
MOSFETs, this is best done by routing power to the
MOSFETs from outside using the top copper layer,
while tying in PGND and LX
inside
(underneath) the
SO-8 package.
When trade-offs in trace lengths must be made, it’s
preferable to allow the inductor charging path to be
made longer than the discharge path. For example,
it’s better to allow some extra distance between the
input capacitors and the high-side MOSFET than to
allow distance between the inductor and the low-
side MOSFET or between the inductor and the out-
put filter capacitor.
Ensure that the OUT connection to C
OUT
is short and
direct. However, in some cases it may be desirable to
deliberately introduce some trace length between the
OUT inductor node and the output filter capacitor (see
the
All-Ceramic-Capacitor Application
section).
Route high-speed switching nodes (BST, LX, DH, and
DL) away from sensitive analog areas (REF, FB).
Make all pin-strap control input connections (
SKIP
,
ILIM, etc.) to AGND or V
CC
rather than PGND or V
DD
.
Layout Procedure
1) Place the power components first, with ground termi-
nals adjacent (Q2 source, CIN-, COUT-, D1 anode). If
possible, make all these connections on the top layer
with wide, copper-filled areas.
2) Mount the controller IC adjacent to MOSFET Q2,
preferably on the back side opposite Q2 in order to
keep LX, PGND, and the DL gate-drive lines short and
wide. The DL gate trace must be short and wide,
measuring 10 to 20 squares (50 to 100 mils wide if the
MOSFET is 1 inch from the controller IC).
3) Group the gate-drive components (BST diode and
capacitor, V
DD
bypass capacitor) together near the
controller IC.
4) Make the DC-DC controller ground connections as
shown in Figure 11. This diagram can be viewed as
having three separate ground planes: output ground,
where all the high-power components go; the PGND
plane, where the PGND pin and V
DD
bypass capaci-
tor go; and an analog AGND plane, where sensitive
analog components go. The analog ground plane and
PGND plane must meet only at a single point directly
beneath the IC. For the MAX1714B, this point should
be the GND pin. These two planes are then connect-
ed to the high-power output ground with a short con-
nection from V
DD
cap/PGND to the source of the
low-side MOSFET, Q2 (the middle of the star ground).
This point must also be very close to the output
capacitor ground terminal.
5) Connect the output power planes (V
CORE
and system
ground planes) directly to the output filter capacitor
positive and negative terminals with multiple vias.
Place the entire DC-DC converter circuit as close to
the CPU as is practical.
M
High-Speed Step-Down Controller
for Notebook Computers
______________________________________________________________________________________
21
DL
AGND
(GND)
OUT
PGND
(GND)
( ) ARE FOR THE MAX1714B ONLY.
DH
FB
V
BATT
V
OUT
R1
R2
MAX1714
Figure 9. Setting V
OUT
with a Resistor-Divider
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MAX1714AEEP | High-Speed Step-Down Controller for Notebook Computers |
| MAX1714BEEE | High-Speed Step-Down Controller for Notebook Computers |
| MAX1715 | Ultra-High Efficiency, Dual Step-Down Controller for Notebook Computers |
| MAX1715EEI | Ultra-High Efficiency, Dual Step-Down Controller for Notebook Computers |
| MAX1717 | Replaced by TMS320VC5506 : Digital Signal Processors 132-BQFP |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MAX17140AETL+T | 制造商:Maxim Integrated Products 功能描述:DC-DC FOR TV - Tape and Reel |
| MAX17140ETL+ | 功能描述:電池管理 12Ch Battery Sensor w/SMBus Ladder RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| MAX17140ETL+T | 功能描述:電池管理 12Ch Battery Sensor w/SMBus Ladder RoHS:否 制造商:Texas Instruments 電池類型:Li-Ion 輸出電壓:5 V 輸出電流:4.5 A 工作電源電壓:3.9 V to 17 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:VQFN-24 封裝:Reel |
| MAX17140EVKIT+ | 功能描述:電源管理IC開發(fā)工具 MAX17140 Eval Kit RoHS:否 制造商:Maxim Integrated 產(chǎn)品:Evaluation Kits 類型:Battery Management 工具用于評(píng)估:MAX17710GB 輸入電壓: 輸出電壓:1.8 V |
| MAX17141ETG+ | 功能描述:轉(zhuǎn)換 - 電壓電平 V6 Level Shifter RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。