M
High-Speed Step-Down Controller
for Notebook Computers
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
V+ to AGND (Note 1)..............................................-0.3V to +30V
V
DD
, V
CC
to AGND (Note 1).....................................-0.3V to +6V
PGND to AGND (Note 1)................................................... ±0.3V
SHDN,
PGOOD, OUT to AGND (Note 1)..................-0.3V to +6V
ILIM, FB, REF,
SKIP
,
TON to AGND (Notes 1, 2)....................-0.3V to (V
CC
+ 0.3V)
DL to PGND (Note 1)..................................-0.3V to (V
DD
+ 0.3V)
BST to AGND (Note 1)...........................................-0.3V to +36V
DH to LX.....................................................-0.3V to (BST + 0.3V)
Note 1:
For the MAX1714B, AGND and PGND refer to a single pin designated GND.
Note 2:
SKIP
may be forced below -0.3V, temporarily exceeding the absolute maximum rating, disabling over/undervoltage fault
detection for the purpose of debugging prototypes (Figure 6). Limit the current drawn to 5mA maximum.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
LX to BST..................................................................-6V to +0.3V
REF Short Circuit to AGND.........................................Continuous
Continuous Power Dissipation (T
A
= +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)..........667mW
20-Pin QSOP (derate 9.1mW/°C above +70°C)..........727mW
Operating Temperature Range ..........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range ............................-65°C to +150°C
Lead Temperature (soldering, 10s).................................+300°C
V+ = 4.5V to 28V,
SKIP
= V
CC
V
SHDN
= 0 , V+ = 28V, V
CC
= V
DD
= 0 or 5V
V
CC
= 4.5V to 5.5V, no external REF load
V
SHDN
= 0
V
CC,
V
DD
V
SHDN
= 0
Battery voltage, V+
FB forced above the regulation point
FB forced above the regulation point
Rising edge of
SHDN
to full I
LIM
TON = AGND (600kHz)
(Note 4)
V+ = 24V,
V
OUT
= 2V
(Note 4)
I
LOAD
= 0 to 3A,
SKIP
= V
CC
V
CC
= 4.5V to 5.5V, V+ = 4.5V to 28V
CONDITIONS
μA
V
<1
2
5
Shutdown Supply Current (V+)
Reference Voltage
μA
<1
5
Shutdown Supply Current (V
DD
)
μA
<1
5
Shutdown Supply Current (V
CC
)
μA
25
40
Quiescent Supply Current (V+)
μA
<1
5
Quiescent Supply Current (V
DD
)
μA
550
750
Quiescent Supply Current (V
CC
)
ns
400
500
Minimum Off-Time
380
425
470
260
290
320
175
200
225
V
0.99
2.475
3.267
1.0
2.5
3.3
1.01
2.525
3.333
Error Comparator Threshold
(DC Output Voltage Accuracy)
(Note 3)
TON = REF (450kHz)
TON = unconnected (300kHz)
TON = V
CC
(200kHz)
4.5
5.5
V
2
28
Input Voltage Range
ns
140
160
180
On-Time
ms
1.7
Soft-Start Ramp Time
μA
k
-0.1
100
0.1
300
FB Input Bias Current
OUT Input Resistance
mV
mV
9
5
Load Regulation Error
Line Regulation Error
UNITS
MIN
TYP
MAX
PARAMETER
Falling edge, hysteresis = 40mV
REF in regulation
I
REF
= 0 to 50μA
V
1.6
REF Fault Lockout Voltage
μA
10
REF Sink Current
V
0.01
Reference Load Regulation
1.98
2.02
ELECTRICAL CHARACTERISTICS
(Circuit of Figure 1, 4A components from Table 1, V+ = +15V, V
CC
= V
DD
= +5V,
SKIP
= AGND,
T
A
=
0°C to +85°C
, unless otherwise
noted.) (Note 1)
FB = AGND
190
FB = OUT
FB = AGND
FB = V
CC