參數(shù)資料
型號: M7A3PE600-FFG256I
元件分類: FPGA
英文描述: FPGA, 600000 GATES, PBGA256
封裝: 1 MM PITCH, FBGA-256
文件頁數(shù): 119/168頁
文件大?。?/td> 1335K
代理商: M7A3PE600-FFG256I
ProASIC3E Flash Family FPGAs
2- 42
Advanced v0.5
Simultaneous Switching Outputs and Printed Circuit Board Layout
Simultaneously switching outputs (SSO) can cause signal
integrity problems on adjacent signals that are not part
of the SSO bus. Both inductive and capacitive coupling
parasitics of bond wires inside packages and of traces on
printed circuit boards (PCBs) will transfer noise from SSO
busses
onto
signals
adjacent
to
those
busses.
Additionally, SSOs can produce ground bounce noise and
VCCI dip noise. These two noise types are caused by
rapidly-changing
currents
through
GND
and
VCCI
package pin inductances during switching activities
Ground bounce noise voltage = L (GND) × di/dt
EQ 2-1
VCCI dip noise voltage = L (VCCI) × di/dt
EQ 2-2
Any group of four or more input pins switching on the
same clock edge is considered an SSO bus. The shielding
should be done both on the board and inside the
package unless otherwise described.
In-package shielding can be achieved in several ways; the
required shielding will vary depending on whether pins
next to the SSO bus are LVTTL/LVCMOS inputs, LVTTL/
LVCMOS outputs, or GTL/SSTL/HSTL/LVDS/LVPECL inputs
and outputs. Board traces in the vicinity of the SSO bus
have to be adequately shielded from mutual coupling
and inductive noise that can be generated by the SSO
bus. Also, noise generated by the SSO bus needs to be
reduced inside the package.
PCBs perform an important function in feeding stable
supply voltage to the IC and at the same time maintain
signal integrity between devices.
Key issues that need to considered are as follows:
Power and ground plane design and decoupling
network design
Transmission line reflections and terminations
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