參數(shù)資料
型號: M24C01-RMB3T/S
廠商: STMICROELECTRONICS
元件分類: PROM
英文描述: 128 X 8 I2C/2-WIRE SERIAL EEPROM, DSO8
封裝: 2 X 3 MM, MLP-8
文件頁數(shù): 24/33頁
文件大?。?/td> 278K
代理商: M24C01-RMB3T/S
Part numbering
M24C16, M24C08, M24C04, M24C02, M24C01
8
Part numbering
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST Sales Office.
The category of second Level Interconnect is marked on the package and on the inner box
label, in compliance with JEDEC Standard JESD97. The maximum ratings related to
soldering conditions are also marked on the inner box label.
Table 20.
Ordering information scheme
Example:
M24C16
W DW 3
T
P /W
Device Type
M24 = I2C serial access EEPROM
Device Function
16 = 16 Kbit (2048 x 8)
08 = 8 Kbit (1024 x 8)
04 = 4 Kbit (512 x 8)
02 = 2 Kbit (256 x 8)
01 = 1 Kbit (128 x 8)
Operating Voltage
W = VCC = 2.5 to 5.5V (400 kHz)
R = VCC = 1.8 to 5.5V (400 kHz)
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB = UDFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
DS = TSSOP8 (3x3mm body size, MSOP8)(1)
1.
Products sold in this package are Not Recommended for New Design.
Device Grade
6 = Industrial temperature range, –40 to 85 °C.
Device tested with standard test flow
3 = Device tested with High Reliability Certified Flow(2).
Automotive temperature range (–40 to 125 °C)
2.
ST strongly recommends the use of the Automotive Grade devices for use in an automotive
environment. The High Reliability Certified Flow (HRCF) is described in the quality note
QNEE9801. Please ask your nearest ST sales office for a copy.
Option
T = Tape and Reel Packing
Plating Technology
blank = Standard SnPb plating
P or G = ECOPACK (RoHS compliant)
Process(3)
3.
Used only for Device Grade 3.
/W or /S = F6SP36%
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