- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3980 > KXPC8240LVV200E (Freescale Semiconductor)IC MPU INTEGRATED 250MHZ 352TBGA PDF資料下載
參數(shù)資料
| 型號： | KXPC8240LVV200E |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 39/52頁 |
| 文件大小： | 0K |
| 描述： | IC MPU INTEGRATED 250MHZ 352TBGA |
| 標(biāo)準(zhǔn)包裝： | 2 |
| 系列： | MPC82xx |
| 處理器類型： | 32-位 MPC82xx PowerQUICC II |
| 速度： | 200MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 352-LBGA |
| 供應(yīng)商設(shè)備封裝： | 352-TBGA（35x35） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁當(dāng)前第39頁第40頁第41頁第42頁第43頁第44頁第45頁第46頁第47頁第48頁第49頁第50頁第51頁第52頁
44
MPC8240 Integrated Processor Hardware Specifications
System Design Information
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
Thermagon Inc.
888-246-9050
4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com
The following section provides a heat sink selection example using one of the commercially-available heat
sinks.
1.7.8.3
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature, TJ, can be expressed as follows:
TJ = TA + TR + (RθJC + RθINT + RθSA) × PD
where
TJ is the die-junction temperature
TA is the inlet cabinet ambient temperature
TR is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
RθINT is the adhesive or interface material thermal resistance
RθSA is the heat sink base-to-ambient thermal resistance
PD is the power dissipated by the device
During operation, the die-junction temperatures (TJ) should be maintained at less than the value specified
in Table 2. The temperature of the air cooling the component greatly depends on the ambient inlet air
temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air
temperature (TA) may range from 30° to 40°C. The air temperature rise within a cabinet (TR) may be in the
range of 5° to 10°C. The thermal resistance of the thermal interface material (RθINT) is typically about
1°C/W. Assuming a TA of 30°C, a TR of 5°C, a TBGA package RθJC = 1.8, and a power consumption (PD)
of 5.0 watts, the following expression for TJ is obtained for die-junction temperature:
TJ = 30°C + 5°C + (1.8°C/W + 1.0°C/W + RθSA) × 5.0 W
For preliminary heat sink sizing, the heat sink base-to-ambient thermal resistance is needed from the heat
sink manufacturer.
Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common figure
of merit used for comparing the thermal performance of various microelectronic packaging technologies,
one should exercise caution when using only this metric in determining thermal management because no
single parameter can adequately describe three-dimensional heat flow. The final die-junction operating
temperature is not only a function of the component-level thermal resistance, but the system-level design
and its operating conditions. In addition to the component's power consumption, a number of factors affect
the final operating die-junction temperature: airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, and so on.
Due to the complexity and the many variations of system-level boundary conditions for today’s
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
F
re
e
sc
a
le
S
e
m
ic
o
n
d
u
c
to
r,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMM43DREF | CONN EDGECARD 86POS .156 EYELET |
| IDT70V657S15BF | IC SRAM 1.125MBIT 15NS 208FBGA |
| KXPC823VR81B2T | IC MPU POWERQUICC 81MHZ 256-PBGA |
| HMM44DREN | CONN EDGECARD 88POS .156 EYELET |
| KMPC880VR80 | IC MPU POWERQUICC 80MHZ 357PBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| KXPC8240LZU200E | 制造商:Freescale Semiconductor 功能描述: |
| KXPC8240RVV250E | 功能描述:IC MPU INTEGRATED 250MHZ 352TBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC82xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| KXPC8250AZUPHBA | 制造商:Motorola Inc 功能描述: |
| KXPC8255CVVIFBC | 功能描述:微處理器 - MPU PQ 2 HIP 3 NO-PB RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| KXPC8255CZUIFBC | 功能描述:微處理器 - MPU POWERQUICC II HIP3 REV C RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。