參數(shù)資料
型號: ISP1562
廠商: NXP Semiconductors N.V.
英文描述: Hi-Speed Universal Serial Bus PCI Host Controller
中文描述: 高速通用串行總線PCI主機控制器
文件頁數(shù): 90/98頁
文件大?。?/td> 442K
代理商: ISP1562
9397 750 14223
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 14 July 2005
90 of 98
Philips Semiconductors
ISP1562
USB PCI Host Controller
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
19. Abbreviations
20. References
[1]
[2]
[3]
[4]
[5]
Universal Serial Bus Specification Rev. 2.0
Enhanced Host Controller Interface Specification for Universal Serial Bus Rev. 1.0
Open Host Controller Interface Specification for USB Rev. 1.0a
PCI Local Bus Specification Rev. 2.2
PCI Bus Power Management Interface Specification Rev. 1.1
Table 124: Abbreviations
Acronym
CMOS
DID
EEPROM
EHCI
EMI
ESD
HC
HCCA
HCD
OHCI
PCI
PCI-SIG
PLL
PMC
PME
PMCSR
POR
STB
USB
VID
Description
Complementary Metal-Oxide Semiconductor
Device ID
Electrically Erasable Programmable Read-Only Memory
Enhanced Host Controller Interface
Electro-Magnetic Interference
Electro-Static Discharge
Host Controller
Host Controller Communication Area
Host Controller Driver
Open Host Controller Interface
Peripheral Component Interconnect
PCI-Special Interest Group
Phase-Locked Loop
Power Management Capabilities
Power Management Event
Power Management Control/Status
Power-On Reset
Set-Top Box
Universal Serial Bus
Vendor ID
相關(guān)PDF資料
PDF描述
ISP1562BE Hi-Speed Universal Serial Bus PCI Host Controller
ISP1581 Universal Serial Bus 2.0 high-speed interface device
ISP1581BD Universal Serial Bus 2.0 high-speed interface device
ISP1582 Hi-Speed Universal Serial Bus peripheral controller
ISP1582BS Hi-Speed Universal Serial Bus peripheral controller
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1562BE 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Hi-Speed USB PCI host controller
ISP1562BE,518 功能描述:USB 接口集成電路 USB 2.0 PCI HOST RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1562BE,551 功能描述:USB 接口集成電路 USB 2.0 PCI HOST RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1562BE,557 功能描述:USB 接口集成電路 DO NOT USE ORDER -S OR -T PART RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1562BEGA 功能描述:IC USB HOST CTRL HI-SPD 100LQFP RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:- 標(biāo)準包裝:3,000 系列:- 應(yīng)用:PDA,便攜式音頻/視頻,智能電話 接口:I²C,2 線串口 電源電壓:1.65 V ~ 3.6 V 封裝/外殼:24-WQFN 裸露焊盤 供應(yīng)商設(shè)備封裝:24-QFN 裸露焊盤(4x4) 包裝:帶卷 (TR) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:1015 (CN2011-ZH PDF) 其它名稱:296-25223-2