參數(shù)資料
型號： IRF6602
廠商： International Rectifier
英文描述： HEXFET Power MOSFET
中文描述： HEXFET功率MOSFET
文件頁數(shù)： 1/11頁
文件大小： 200K
代理商： IRF6602
www.irf.com
1
3/1/04
IRF6602/IRF6602TR1
HEXFET Power MOSFET
V
DSS
R
DS(on)
max
20V
13m
@V
GS
= 10V
19m
@V
GS
= 4.5V
Notes
through
are on page 11
Qg
12nC
DirectFET
ISOMETRIC
Description
The IRF6602 combines the latest HEXFET Power MOSFET Silicon technology with the advanced DirectFET
TM
packaging to
achieve the lowest on-state resistance charge product in a package that has the footprint of an SO-8 and only 0.7 mm profile.
The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment
and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the
manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in
power systems, IMPROVING previous best thermal resistance by 80%.
The IRF6602 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction
and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the
latest generation of processors operating at higher frequencies. The IRF6602 has been optimized for parameters that are
critical in synchronous buck converters including Rds(on) and gate charge to minimize losses in the control FET socket.
Absolute Maximum Ratings
Parameter
V
DS
Drain-to-Source Voltage
V
GS
Gate-to-Source Voltage
I
D
@ T
C
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 25°C
Continuous Drain Current, V
GS
@ 10V
I
D
@ T
A
= 70°C
Continuous Drain Current, V
GS
@ 10V
I
DM
P
D
@T
A
= 25°C
P
D
@T
A
= 70°C
P
D
@T
C
= 25°C
Power Dissipation
Linear Derating Factor
T
J
Operating Junction and
T
STG
Storage Temperature Range
Thermal Resistance
Parameter
R
θ
JA
R
θ
JA
R
θ
JA
R
θ
JC
R
θ
J-PCB
Junction-to-PCB Mounted
Application Specific MOSFETs
Ideal for CPU Core DC-DC Converters
Low Conduction Losses
Low Switching Losses
Low Profile (<0.7 mm)
Dual Sided Cooling Compatible
Compatible with existing Surface Mount Techniques
Units
V
A
Pulsed Drain Current
Power Dissipation
Power Dissipation
W
W/°C
°C
Typ.
–––
12.5
20
–––
1.0
Max.
55
–––
–––
3.0
–––
Units
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
°C/W
Max.
20
11
8.9
89
2.3
1.5
42
±20
48
-40 to + 150
0.018
Applicable DirectFET Package/Layout Pad (see p.9, 10 for details)
SQ
SX
ST
MQ
MX
MT
相關(guān)PDF資料
PDF描述
IRF6602TR1 HEXFET Power MOSFET
IRF6603 HEXFETPower MOSFET
IRF6613 VCXO TCXO VCTCXO
IRF6616 DirectFET Power MOSFET
IRF6618PBF DirectFET㈢Power MOSFET ㈢
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IRF6602TR1 制造商:IRF 制造商全稱:International Rectifier 功能描述:HEXFET Power MOSFET
IRF6603 功能描述:MOSFET 30V 1 N-CH HEXFET 8.1mOhms 11nC RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
IRF6603TR1 功能描述:MOSFET 30V 1 N-CH HEXFET 8.1mOhms 11nC RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
IRF6604 功能描述:MOSFET RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
IRF6604TR1 功能描述:MOSFET RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS（導(dǎo)通）:0.014 Ohms 配置:Single 最大工作溫度: 安裝風(fēng)格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
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