參數資料
型號: IRF3709ZS
廠商: International Rectifier
英文描述: HEXFET Power MOSFET
中文描述: HEXFET功率MOSFET
文件頁數: 8/12頁
文件大小: 345K
代理商: IRF3709ZS
8
www.irf.com
Control FET
!" # $
%& !"
#
#'
P
loss
= P
conduction
+ P
switching
+ P
drive
+ P
output
This can be expanded and approximated by;
(
)
P
loss
=
I
rms
2
×
R
ds(on)
+
I
×
Q
gd
(
i
g
×
V
in
×
f
+
I
×
Q
gs2
i
g
×
V
in
×
f
+
Q
g
×
V
g
×
f
)
+
Q
oss
2
×
V
in
×
f
"(
%&
!"
%& !"
"
)
#
*
%+
%& !"#
# ,
-
./
#
#
#
Synchronous FET
The power loss equation for Q2 is approximated
by;
P
loss
=
P
conduction
+
P
drive
+
P
output
(
+
Q
g
×
V
g
×
f
(
Q
oss
2
*
P
loss
=
I
rms
2
×
R
ds(on)
)
+
×
V
in
×
f
+
Q
rr
×
V
in
×
f
(
)
*dissipated primarily in Q1.
For the synchronous MOSFET Q2, R
is an im-
portant characteristic; however, once again the im-
portance of gate charge must not be overlooked since
it impacts three critical areas. Under light load the
MOSFET must still be turned on and off by the con-
trol IC so the gate drive losses become much more
significant. Secondly, the output charge Q
and re-
verse recovery charge Q
both generate losses that
are transfered to Q1 and increase the dissipation in
that device. Thirdly, gate charge will impact the
MOSFETs’ susceptibility to Cdv/dt turn on.
The drain of Q2 is connected to the switching node
of the converter and therefore sees transitions be-
tween ground and V
. As Q1 turns on and off there is
a rate of change of drain voltage dV/dt which is ca-
pacitively coupled to the gate of Q2 and can induce
a voltage spike on the gate that is sufficient to turn
the MOSFET on, resulting in shoot-through current .
The ratio of Q
/Q
must be minimized to reduce the
potential for Cdv/dt turn on.
Power MOSFET Selection for Non-Isolated DC/DC Converters
Figure A: Q
oss
Characteristic
相關PDF資料
PDF描述
IRF3709Z HEXFET Power MOSFET
IRF3709 Power MOSFET(Vdss=30V, Rds(on)max=9.0mohm, Id=90A)
IRF3709L Power MOSFET(Vdss=30V, Rds(on)max=9.0mohm, Id=90A)
IRF3709S Power MOSFET(Vdss=30V, Rds(on)max=9.0mohm, Id=90A)
IRF3710L Power MOSFET(Vdss=100V, Rds(on)=0.025ohm, Id=57A)
相關代理商/技術參數
參數描述
IRF3709ZSPBF 功能描述:MOSFET 30V 1 N-CH 6.3mOhm HEXFET 17nC RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS(導通):0.014 Ohms 配置:Single 最大工作溫度: 安裝風格:Through Hole 封裝 / 箱體:Max247 封裝:Tube
IRF3709ZSTRL 功能描述:MOSFET N-CH 30V 87A D2PAK RoHS:否 類別:分離式半導體產品 >> FET - 單 系列:HEXFET® 標準包裝:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金屬氧化物 FET 特點:邏輯電平門 漏極至源極電壓(Vdss):200V 電流 - 連續(xù)漏極(Id) @ 25° C:18A 開態(tài)Rds(最大)@ Id, Vgs @ 25° C:180 毫歐 @ 9A,10V Id 時的 Vgs(th)(最大):4V @ 250µA 閘電荷(Qg) @ Vgs:72nC @ 10V 輸入電容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安裝類型:通孔 封裝/外殼:TO-220-3 整包 供應商設備封裝:TO-220FP 包裝:管件
IRF3709ZSTRLPBF 功能描述:MOSFET N-CH 30V 87A D2PAK RoHS:是 類別:分離式半導體產品 >> FET - 單 系列:HEXFET® 標準包裝:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金屬氧化物 FET 特點:邏輯電平門 漏極至源極電壓(Vdss):200V 電流 - 連續(xù)漏極(Id) @ 25° C:18A 開態(tài)Rds(最大)@ Id, Vgs @ 25° C:180 毫歐 @ 9A,10V Id 時的 Vgs(th)(最大):4V @ 250µA 閘電荷(Qg) @ Vgs:72nC @ 10V 輸入電容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安裝類型:通孔 封裝/外殼:TO-220-3 整包 供應商設備封裝:TO-220FP 包裝:管件
IRF3709ZSTRR 功能描述:MOSFET N-CH 30V 87A D2PAK RoHS:否 類別:分離式半導體產品 >> FET - 單 系列:HEXFET® 標準包裝:1,000 系列:MESH OVERLAY™ FET 型:MOSFET N 通道,金屬氧化物 FET 特點:邏輯電平門 漏極至源極電壓(Vdss):200V 電流 - 連續(xù)漏極(Id) @ 25° C:18A 開態(tài)Rds(最大)@ Id, Vgs @ 25° C:180 毫歐 @ 9A,10V Id 時的 Vgs(th)(最大):4V @ 250µA 閘電荷(Qg) @ Vgs:72nC @ 10V 輸入電容 (Ciss) @ Vds:1560pF @ 25V 功率 - 最大:40W 安裝類型:通孔 封裝/外殼:TO-220-3 整包 供應商設備封裝:TO-220FP 包裝:管件
IRF3709ZSTRRPBF 功能描述:MOSFET MOSFT 30V 87A 6.3mOhm 17nC Qg RoHS:否 制造商:STMicroelectronics 晶體管極性:N-Channel 汲極/源極擊穿電壓:650 V 閘/源擊穿電壓:25 V 漏極連續(xù)電流:130 A 電阻汲極/源極 RDS(導通):0.014 Ohms 配置:Single 最大工作溫度: 安裝風格:Through Hole 封裝 / 箱體:Max247 封裝:Tube