參數(shù)資料
型號: IDT71V3576S133BQI
廠商: INTEGRATED DEVICE TECHNOLOGY INC
元件分類: SRAM
英文描述: 128K x 36, 256K x 18 3.3V Synchronous SRAMs 3.3V I/O, Pipelined Outputs Burst Counter, Single Cycle Deselect
中文描述: 128K X 36 CACHE SRAM, 4.2 ns, PBGA165
封裝: FBGA-165
文件頁數(shù): 4/22頁
文件大?。?/td> 283K
代理商: IDT71V3576S133BQI
6.42
12
IDT71V3576, IDT71V3578, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
3.3V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
Commercial and Industrial Temperature Ranges
AC Electrical Characteristics
(VDD = 3.3V ±5%, Commercial and Industrial Temperature Ranges)
NOTES:
1. Measured as HIGH above VIH and LOW below VIL.
2. Transition is measured ±200mV from steady-state.
3. Device must be deselected when powered-up from sleep mode.
4. tCFG is the minimum time required to configure the device based on the
LBO input. LBO is a static input and must not change during normal operation.
150MHz
133MHz
Symbol
Parameter
Min.
Max.
Min.
Max.
Unit
tCYC
Clock Cycle Time
6.7
____
7.5
____
ns
tCH(1)
Clock High Pulse Width
2.6
____
3
____
ns
tCL(1)
Clock Low Pulse Width
2.6
____
3
____
ns
Output Parameters
tCD
Clo ck High to Valid Data
____
3.8
____
4.2
ns
tCDC
Clock High to Data Change
1.5
____
1.5
____
ns
tCLZ(2)
Clock High to Output Active
0
____
0
____
ns
tCHZ(2)
Clock High to Data High-Z
1.5
3.8
1.5
4.2
ns
tOE
Output Enable Access Time
____
3.8
____
4.2
ns
tOLZ(2)
Output Enable Low to Output Active
0
____
0
____
ns
tOHZ(2)
Output Enable High to Output High-Z
____
3.8
____
4.2
ns
Set Up Times
tSA
Address Setup Time
1.5
____
1.5
____
ns
tSS
Address Status Setup Time
1.5
____
1.5
____
ns
tSD
Data In Setup Time
1.5
____
1.5
____
ns
tSW
Write Setup Time
1.5
____
1.5
____
ns
tSAV
Address Advance Setup Time
1.5
____
1.5
____
ns
tSC
Chip Enable/Select Setup Time
1.5
____
1.5
____
ns
Hold Times
tHA
Address Hold Time
0.5
____
0.5
____
ns
tHS
Address Status Hold Time
0.5
____
0.5
____
ns
tHD
Data In Hold Time
0.5
____
0.5
____
ns
tHW
Write Hold Time
0.5
____
0.5
____
ns
tHAV
Address Advance Hold Time
0.5
____
0.5
____
ns
tHC
Chip Enable/Select Hold Time
0.5
____
0.5
____
ns
Sleep Mode and Configuration Parameters
tZZPW
ZZ Pulse Width
100
____
100
____
ns
tZZR(3)
ZZ Recovery Time
100
____
100
____
ns
tCFG(4)
Configuration Set-up Time
27
____
30
____
ns
5279 tbl 16
相關(guān)PDF資料
PDF描述
IDT71V3576S133PFI 128K x 36, 256K x 18 3.3V Synchronous SRAMs 3.3V I/O, Pipelined Outputs Burst Counter, Single Cycle Deselect
IDT71V3576S150BG 128K x 36, 256K x 18 3.3V Synchronous SRAMs 3.3V I/O, Pipelined Outputs Burst Counter, Single Cycle Deselect
IDT71V3576S150BGI 128K x 36, 256K x 18 3.3V Synchronous SRAMs 3.3V I/O, Pipelined Outputs Burst Counter, Single Cycle Deselect
IDT71V3576S133PF 128K x 36, 256K x 18 3.3V Synchronous SRAMs 3.3V I/O, Pipelined Outputs Burst Counter, Single Cycle Deselect
IDT71V67903S80B 512K X 18 CACHE SRAM, 8 ns, PBGA119
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
IDT71V3576S133PF 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M(64M x 8) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040
IDT71V3576S133PF8 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:否 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M(64M x 8) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040
IDT71V3576S133PFG 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:72 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步 存儲容量:4.5M(256K x 18) 速度:133MHz 接口:并聯(lián) 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 70°C 封裝/外殼:100-LQFP 供應(yīng)商設(shè)備封裝:100-TQFP(14x20) 包裝:托盤
IDT71V3576S133PFG8 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:72 系列:- 格式 - 存儲器:RAM 存儲器類型:SRAM - 同步 存儲容量:4.5M(256K x 18) 速度:133MHz 接口:并聯(lián) 電源電壓:3.135 V ~ 3.465 V 工作溫度:0°C ~ 70°C 封裝/外殼:100-LQFP 供應(yīng)商設(shè)備封裝:100-TQFP(14x20) 包裝:托盤
IDT71V3576S133PFGI 功能描述:IC SRAM 4MBIT 133MHZ 100TQFP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:MoBL® 格式 - 存儲器:RAM 存儲器類型:SRAM - 異步 存儲容量:16M(2M x 8,1M x 16) 速度:45ns 接口:并聯(lián) 電源電壓:2.2 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-VFBGA 供應(yīng)商設(shè)備封裝:48-VFBGA(6x8) 包裝:帶卷 (TR)