參數(shù)資料
型號: HY27UF081G2M-TES
廠商: HYNIX SEMICONDUCTOR INC
元件分類: DRAM
英文描述: 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
中文描述: 128M X 8 FLASH 3.3V PROM, 30 ns, PDSO48
封裝: 12 X 20 MM, 1.20 MM HEIGHT, TSOP1-48
文件頁數(shù): 44/48頁
文件大小: 476K
代理商: HY27UF081G2M-TES
Rev 0.7 / Apr. 2005
44
Preliminary
HY27UF(08/ 16)1G2M Series
HY27SF(08/ 16)1G2M Series
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
Symbol
Millimeters
Typ
0.90
0.30
0.60
0.45
9.50
4.00
7.20
12.00
5.60
8.80
0.80
2.75
1.15
3.20
1.60
0.40
0.40
Min
0.80
0.25
0.55
0.40
9.40
Max
1.00
0.35
0.65
0.50
9.60
A
A1
A2
b
D
D1
D2
E
E1
E2
e
FD
FD1
FE
FE1
SD
SE
11.90
12.10
'
'
6'
)'
)'
$
$
$
6(
)(
)(
(
(
%$//3$′
(
H
H
GGG
H
E
'
Figure 33. 63-ball FBGA - 9.5 x 12, 6 x 8 ball array 0.8mm pitch, Pakage Outline
NOTE
: Drawing is not to scale.
Table 21: 63-ball FBGA - 9.5 x 12, 6 x 8 ball array 0.8mm pitch, Pakage Mechanical Data
相關(guān)PDF資料
PDF描述
HY27UF081G2M-TIB 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TIP 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TIS 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TMB Inductor; Inductor Type:Power; Inductance:2uH; Inductance Tolerance: 25 %; Series:CTX; Package/Case:PCB Surface Mount; Core Material:Amorphous Metal; Current, lt rms Parallel:7.26A; Current, lt rms Series:3.63A RoHS Compliant: Yes
HY27UF081G2M-TMP 1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HY27UF081G2M-TIB 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TIP 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TIS 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TMB 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory
HY27UF081G2M-TMP 制造商:HYNIX 制造商全稱:Hynix Semiconductor 功能描述:1Gbit (128Mx8bit / 64Mx16bit) NAND Flash Memory