參數(shù)資料
型號(hào)： HDMP-2689
英文描述： Quad 2.125/1.0625 GBd Fibre Channel General Purpose SerDes
中文描述： 四2.125/1.0625 GBd光纖通道通用的SerDes
文件頁(yè)數(shù)： 18/28頁(yè)
文件大小： 356K
代理商： HDMP-2689
18
a) BLOCK DIAGRAM OF RJ MEASUREMENT METHOD
b) BLOCK DIAGRAM OF DJ MEASUREMENT METHOD
2.125 GHz
106.25 MHz
*PATTERN GENERATOR
PROVIDES PATTERN-
SYNCHRONOUS TRIGGER
70311A
CLOCK
SOURCE
Static K28.7 from pattern generator
or user pattern controlled by MDIO
HDMP-2689
RFCN
RFCP
TXnP
TXnN
TDn[9:0]
100
0.1
μ
F
0.1
μ
F
Balun
Balun
CH1
CH2
83480A
OSCILLOSCOPE
TRIGGER
HDMP-2689
RFCN
RFCP
TXnP
TXnN
RDn[9:0]
RXnP
RXnN
2.125 GHz
70311A
CLOCK
SOURCE
-Data
70841B
PATTERN
GENERATOR*
+K28.5, -K28.5
or CRPAT
+Data
106.25 MHz
TDn[9:0]
DIVIDE
BY 20
Trigger Out
Clock In
70841B
PATTERN
GENERATOR*
0011111100 static K28.7
DIVIDE
BY 20
83480A
OSCILLOSCOPE
CH1
CH2
TRIGGER
100
0.1
μ
F
0.1
μ
F
Figure 20. Transmitter DJ and RJ Measurement Method.
Table 19 . Pin Input Capacitance.
Symbol
Parameters
Units
Min
Typ
Max
CINPUT
Input Capacitance on SSTL Input pins
pF
1.1
Package Information
Package Thermal Characteristics
Symbol
Parameter
Units
Typ
Max
P
Dmax
Power Dissipation
W
2.5
θ
JA[1]
Thermal Resistance: Junction to Ambient
Air Flow (LFPM)
0
200
400
600
°
C/W
°
C/W
°
C/W
°
C/W
27.8
24.3
23.1
22.1
Ψ
JT[2]
Thermal Characterization parameter: Junction to package top
°
C/W
4.8
Ψ
JB[3]
Thermal Characterization parameter: Junction to board
°
C/W
19.3
Notes:
Based on independent package testing done by Agilent,
1.
θ
JA
is based on thermal measurement in still air environment at 25
°
C on a standard 4 x 4
”
FR4 PCB as specified in EIA/JESD 51-9.
2.
Ψ
JT
is used to determine the actual junction temperature in a given application, using the following equation:
T
J
=
Ψ
JT
x P
D
+ T
T
where T
T
is the measured temperature on top center of the package (also known as Case temperature, Tc) and P
D
is the power being
dissipated.
3.
Ψ
JB
is used to determine the actual junction temperature in a given application, using the following equation:
T
J
=
Ψ
JB
x P
D
+ T
B
where T
B
is measured board temperature, along the side of package at center on board surface and P
D
is the power being dissipated.
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